As a leader in advanced process control, UnitySC delivers semiconductor metrology and inspection solutions that support the advancement of the semiconductor industry’s heterogeneous integration roadmap. Specifically, our integrated systems target the semiconductor advanced packaging, power semiconductor and MEMS markets, focusing on applications such as through silicon via (TSV) fabrication, fan-out wafer-level packaging, substrate control, hybrid bonding and chemical mechanical planarization (CMP) processes.
We work in collaboration with our customers to develop and implement disruptive semiconductor metrology and inspection systems that provide industrialized solutions to process control problems, enabling them to better understand their processes, manage and improve their yields, and grow their businesses. Our customers include the largest foundries, integrated device manufacturers, outsourced semiconductor assembly and test service providers, and R&D centers.
Our full product portfolio includes:
UnitySC’s visionary approach fosters progress for people. We are differentiated by our IP-protected semiconductor metrology and inspection solutions, along with our reputation as a company with which people like to work. We strive to deliver added value to our customers by implementing our technology expertise in a manner that solves their semiconductor manufacturing problems.
New Facility Enhances Company’s Semiconductor Process Control Capabilities and Supports Growing North America Customer Base
Austin, Texas – Oct. 23, 2017 – UnitySC today announced at the International Wafer Level Packaging Conference (IWLPC) in San Jose, Calif., the opening of Unity Semiconductor Inc., the company’s new global software development center and North America customer demonstration lab located in Austin, Texas. The new facility serves as the company’s main center for software development, and will house the full line of UnitySC metrology and inspection tools. This equipment will provide a demo lab that supports UnitySC’s North America customer base, augmenting the primary demo lab at the company’s global headquarters, located in Grenoble, France.
March 5, 2018 - March 8, 2018
Fountain Hills, Arizona
UnitySC will be exhibiting on booth #60. Dario Alliata, Product Manager will also deliver two talks respectively entitled Progress in Time-Domain Optical Coherence Tomography for TSV/3Di stacking Metrology and Wafer Nano Topography and Edge Roll-Off Metrology for 3D Monolithic Integration. Come to meet with us! And if you wish to pre-arrange a meeting, send us a message.