UnitySC delivers visionary technologies that foster progress for people. We are recognized as a key player in semiconductor metrology and inspection for heterogeneous integration combining advanced technologies to enable higher yields and faster time to market.
Next event: October 24, 2017 - October 26, 2017
San Jose, CA
Wafer Level Packaging is almost everywhere: smartphones, automotive, IoT, medtech, etc…
Meet with us at IWLPC on booth #10 and listen to our talk entitled “Wafer Thinning In-Line Inspection Process Control Solution for High Volume Manufacturing”. To pre-arrange a meeting, send us a message.
Latest Press Release: May 9, 2017
Leading IDM Selects New 4See Series Automated Defect Inspection Platform for Power Semiconductor Automotive Applications
Grenoble, France, May 9, 2017 – UnitySC, a leader in advanced inspection and metrology solutions, today announced multiple orders from a leading integrated device manufacturer (IDM) for its modular 4See Series automated defect inspection platform. The systems were selected because they deliver optimal wafer backside surface and edge defect inspection post thinning and metallization. The 4See Series will be used for automotive applications by a market leader in power semiconductor manufacturing to improve the reliability and performance of its products.
RT @Jan_TechSearch: Great discussions on future packaging trends at IMAPS including FO-WLPs, Intel's new LGA (long live LGA), and Xilinx HB…
13 October 2017
21 September 2017
20 September 2017