+33 (0)456 526 800

UnitySC expands

Opens U.S. Office

power semiconductors, Semiconductor Metrology and Inspection

Power Semiconductors

Post Backside Wafer Thinning and Metallization Inspection

NST Series

A Game Changer in Nanotopography


Who we are

As a leader in advanced process control, UnitySC delivers semiconductor metrology and inspection solutions that support the advancement of the semiconductor industry’s heterogeneous integration roadmap. Specifically, our integrated systems target the semiconductor advanced packaging, power semiconductor and MEMS markets, focusing on applications such as through silicon via (TSV) fabrication, fan-out wafer-level packaging, substrate control, hybrid bonding and chemical mechanical planarization (CMP) processes.

We work in collaboration with our customers to develop and implement disruptive semiconductor metrology and inspection systems that provide industrialized solutions to process control problems, enabling them to better understand their processes, manage and improve their yields, and grow their businesses. Our customers include the largest foundries, integrated device manufacturers, outsourced semiconductor assembly and test service providers, and R&D centers.

UnitySC’s integrated process control systems leverage multiple optical techniques for semiconductor metrology and inspection, including:

  • Time-domain infrared optical coherence tomography (OCT)
  • Full field interferometry (VSI and PSI)
  • Phase-shifting deflectometry
  • Chromatic confocal microscopy
  • Laser Doppler velocimetry
  • Reflectometry
  • Infrared microscopy

Our full product portfolio includes:

  • The TMAP Series, for accurate and repeatable wafer geometry measurements such as thickness, total thickness variation (TTV), and the shape and flatness of mono- and multilayer substrates for all kinds of materials.
  • The NST Series, a noncontact full-field metrology solution based on optical microscopy, enabling surface topography measurements at the nanoscale.
  • The 4SEE Series, a modular platform for all-surface inspection that ensures wafer frontside, backside and edge quality by detecting, counting, and binning particles and defects during the wafer manufacturing process.

UnitySC’s visionary approach fosters progress for people. We are differentiated by our IP-protected semiconductor metrology and inspection solutions, along with our reputation as a company with which people like to work. We strive to deliver added value to our customers by implementing our technology expertise in a manner that solves their semiconductor manufacturing problems.

Latest Articles

Combined Core Competencies Deliver comprehensive Inspection and Metrology Offering for FULL SPECTRUM OF SEMICONDUCTOR APPLICATIONS

Grenoble, France – March 20, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced it acquired 100% of the shares of HSEB Dresden, GmbH (HSEB), a leading supplier in optical inspection, review and metrology for high-value semiconductor applications. Following the acquisition, the new entity’s extended line of leading-edge process control solutions will provide a unique and essential inspection and metrology capability to semiconductor manufacturers. Together, the entity’s offerings span substrate, front-end-of-line (FEOL) manufacturing, wafer-level packaging, 3D ICs and power semiconductors. Further, bringing together the two companies will strengthen worldwide customer support for all platforms.

Read More

Upcoming Events

May 29, 2018 - June 1, 2018

2018 IEEE 68th Electronic Components and Technology Conference

San Diego, California
This year again, UnitySC is proud to be Gold Sponsor of ECTC which brings together around 1,500 professionals from the global microelectronics packaging industry, for four consecutive days packed with Technical presentations. We will be exhibiting in booth #406. Go to our contact form to arrange a meeting with our team!

UnitySC delivers visionary technologies that foster progress for people. We are recognized as a key player in inspection and metrology combining advanced technologies to enable higher yields and faster time to market.

+33 (0)456 526 800