Advanced packaging is now mainstream, but making sure these devices work properly while also cutting costs is getting harder. As advanced packaging moves into the mainstream, packaging houses and equipment makers are ratcheting up efforts to solve persistent metrology and inspection issues. The goal is to lower the cost of fan-outs, 2.5D and 3D-IC, along with a number of other packaging variants consistent with the kinds of gains that are normally associated with Moore’s Law. [Semiconductor Engineering]
2.5D, Fan-Out Inspection Issues Grow
May 16, 2017