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Event dates: November 14, 2017 - November 17, 2017

SEMICON Europa 2017

Munich, Germany
For the first time, SEMICON Europa will be co-located with Productronica. UnitySC will be exhibiting on booth #B1-1008. To pre-arrange a meeting, send us a message.

Event dates: October 24, 2017 - October 26, 2017

IWLPC

San Jose, CA
Wafer Level Packaging is almost everywhere: smartphones, automotive, IoT, medtech, etc…
Meet with us at IWLPC on booth #10 and listen to our talk entitled “Wafer Thinning In-Line Inspection Process Control Solution for High Volume Manufacturing”. To pre-arrange a meeting, send us a message.

Event dates: October 9, 2017 - October 12, 2017

IMAPS 2017

Raleigh, NC
UnitySC will be exhibiting on booth #421 and delivering a talk entitled “In line Advanced Process Control Solution for the Fabrication of Micro-bumps”. Come to meet with us. To pre-arrange a meeting, send us a message.

Event dates: September 20, 2017 - July 22, 2017

SEMI MEMS and Sensors 2017

Grenoble, France
3rd edition of the SEMI MEMS and Sensor Summit will take place in Grenoble from Sept 20th to 22nd. Looking for versatile process control solutions compliant with high volume manufacturing ? Stop by our booth #21 to learn about our TMap Series and 4See Series. To pre-arranged a meeting, send us a message.

Event dates: September 13, 2017 - September 15, 2017

SEMICON Taiwan 2017

Taipei Nangang Exhibition Center, Taiwan
Taiwan is a key region for UnitySC with many customers and tools installed. From Sept 13 to 15th, we will be co-exhibiting with our local representative, Kingyoup Entreprises. Visit us on booth #930, 4th floor, and learn more about our innovative product lines. To pre-arrange a meeting at the show,  send us a message.

Most would agree that in order for advanced packaging solutions to lead the industry and fill the role previously held by semiconductor scaling it must see advances in infrastructure building and significant focus by all players to lower costs. For sure, this will take total industry unity. With this cheap play on words we are led to todays topic… A few blogs ago (see IFTLE 332: “Wither Goest the Toshiba NAND business; Unity SC”) we mentioned that Fogale’s semiconductor division had become UnitySC. This week, we’d like to take a closer look at what this means to the advanced packaging industry [Solid State Technology].

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Gilles Fresquet, CEO of UnitySC, mentionned in the article written by Francoise von Trapp for 3DInCites.
[…] UnitySC filled me in on their most recent inspection platform targeting heterogeneous integration, the 4See Series, an all-surface wafer inspection system designed as a completed solution for 2D and 3D optical and edge inspection. According to Unity’s Gilles Fresquet, it’s the only inspection platform that can be configured to inspect all around and through the wafer. The platform features a deflector module that uses phase shift deflectometry for wafer surface inspection, an edge and line-scan modules that rely on confocal chromatic technology […] [3DInCites]

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Gilles Fresquet, CEO of UnitySC, mentionned in the article written by Francoise von Trapp for 3DInCites.

The fan-out conversation that started at IMAPS DPC 2017 in March continued this week at the annual Electronics Components Technology Conference (ECTC), which took place in Orlando at the Walt Disney World Swan and Dolphin Resort. The buzz started during the Tuesday evening plenary session, where panelists Douglas Yu, TSMC, Tim Olson, Deca Technologies; Steffen Kroehnert, NANIUM; Rolf Aschenbrenner, Fraunhofer IZM; and Steve Bezuk, Qualcomm Technologies, Inc. discussed the why, how and when of panel-level fan out (PLFO) [3DIncites].

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What is expected from inspection and metrology equipment, and how will it evolve in the future?

Advanced packaging has grown into a complex ecosystem with a variety of business models and a series of players involved, from initial wafer processing steps to final package delivery and subsequent board assembly. The spotlight has turned to advanced packaging as one of the solutions to bring further value to the semiconductor product in terms of cost reduction and functionality increase […]. Our lead analysts for the areas of equipment and materials sat down with UnitySC CEO Gilles Fresquet and Global Marketing Manager Yann Guillou to discuss the trends in advanced packaging and their impact on inspection and metrology tools [I-Micronews].

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Advanced packaging is now mainstream, but making sure these devices work properly while also cutting costs is getting harder. As advanced packaging moves into the mainstream, packaging houses and equipment makers are ratcheting up efforts to solve persistent metrology and inspection issues. The goal is to lower the cost of fan-outs, 2.5D and 3D-IC, along with a number of other packaging variants consistent with the kinds of gains that are normally associated with Moore’s Law. [Semiconductor Engineering]

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UnitySC delivers visionary technologies that foster progress for people. We are recognized as a key player in inspection and metrology combining advanced technologies to enable higher yields and faster time to market.

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+33 (0)456 526 800

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