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Advanced packaging is now mainstream, but making sure these devices work properly while also cutting costs is getting harder. As advanced packaging moves into the mainstream, packaging houses and equipment makers are ratcheting up efforts to solve persistent metrology and inspection issues. The goal is to lower the cost of fan-outs, 2.5D and 3D-IC, along with a number of other packaging variants consistent with the kinds of gains that are normally associated with Moore’s Law. [Semiconductor Engineering]

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Leading IDM Selects New 4See Series Automated Defect Inspection Platform for Power Semiconductor Automotive Applications

Grenoble, France, May 9, 2017UnitySC, a leader in advanced inspection and metrology solutions, today announced multiple orders from a leading integrated device manufacturer (IDM) for its modular 4See Series automated defect inspection platform. The systems were selected because they deliver optimal wafer backside surface and edge defect inspection post thinning and metallization. The 4See Series will be used for automotive applications by a market leader in power semiconductor manufacturing to improve the reliability and performance of its products.

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Event dates: July 11, 2017 - July 13, 2017

SEMICON West

San Francisco, CA
1 year ago, UnitySC was launched at SEMICON West 2016. What a busy year with so many achievements since July 2016! Stop by our booth to learn about our full advanced process control product portfolio for heterogeneous integration. UnitySC will be exhibiting on the SEMI European Pavilion located on North Hall, booth #6468.

Go to our contact form to arrange a meeting with our team.

http://www.semiconwest.org

 

Metrology and inspection company Unity Semiconductor SAS (Grenoble, France), is experiencing strong growth and expects to double its sales year-on-year in 2017. We asked CEO Gilles Fresquet to explain why and provide some background. [eeNews Europe]

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Event dates: April 20, 2017 - April 21, 2017

Advanced Packaging & System Integration Technology Symposium

Wuxi, China
Dario Alliata, Product Manager, will deliver a talk entitled “Advanced Packaging Process Control for High Volume Manufacturing“. In addition, our Business Development team will be attending to meet with attendees and promote our product offer.

NST Series Provides Non-Contact Full Field Profilometry to 0.1nm Resolution; Delivers Unique Overlay Solution for Hybrid Bonding

Grenoble, France, March 14, 2017 – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today introduced its new NST Series at SEMICON China in Shanghai. The NST Series is the world’s first non-contact metrology solution for accurately measuring the nanoscale surface topography of semiconductor wafers in high-volume manufacturing.The new platform enables higher wafer yields and throughputs, and targets advanced processes being implemented for next-generation image sensor and memory technologies.

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Event dates: May 31, 2017 - June 1, 2017

ECTC

Lake Buena Vista, Florida
ECTC is the premier international conference on microelectronic packaging, components, and systems technology.
UnitySC is proud to be Gold Sponsor of ECTC. We will be exhibiting in booth #219 and showcasing our full product portfolio of advanced process control solutions. Go to our contact form to arrange a meeting with our team and stop by our booth.

https://www.ectc.net/index.cfm

Event dates: March 14, 2017 - March 17, 2017

SEMICON China

Shanghai New Expo International Center
UnitySC will be exhibiting in booth #5375 in Hall #5. New product launch planned !

www.semiconchina.org/

Event dates: March 6, 2017 - March 9, 2017

IMAPS Device Packaging Conference

Fountain Hills, AZ, USA
UnitySC will be sponsoring the Panel discussion about Fan Out Wafer Level Packaging. Please attend this session and get in touch with our staff during the event.

2016 will be remembered as the year fan-out wafer level packaging (FOWLP) went mainstream, thanks to TSMC’s strategic move in the advanced packaging arena and especially its integrated fan-out (InFO) win inside the iPhone 7. Already in high-volume manufacturing (HVM), FOWLP volumes significantly increased in magnitude. Will this strong momentum continue over the next few years? I believe it will. [3DInCites]

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UnitySC delivers visionary technologies that foster progress for people. We are recognized as a key player in inspection and metrology combining advanced technologies to enable higher yields and faster time to market.

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+33 (0)456 526 800

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