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Unity Semiconductor Limited Company Will Provide Application Engineering and Field Service Support to Local Customers

Hsinchu, Taiwan – May 8, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced the opening of its Asia subsidiary, Unity Semiconductor Limited Company (UnitySC Asia). The entity was established to deliver enhanced customer support for UnitySC’s growing installed base of inspection and metrology tools throughout the region. UnitySC Asia is headquartered at Tai-Yuan Hi-Tech Industrial Park, Jubei City, Hsinchu, Taiwan, and has field offices in Singapore, Korea, and Shanghai, as well as a presence in Japan.

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Ait-Mahiout Brings Strong Track Record of Growth at Amkor Europe and Significant Operational Experience

Grenoble, France – April 17, 2018 – UnitySC, a leader in advanced inspection and metrology solutions for the semiconductor and related industries, today announced that its board of directors has appointed Kamel Ait-Mahiout as chief executive officer. He has also been elected to serve on UnitySC’s board. Following the company’s recent announcement of the acquisition of HSEB Dresden, GmbH, this appointment marks the next step of the company’s aggressive growth strategy for its process control solutions.

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T-MAP 3D

Time-domain Optical Coherence is the most robust solution for TSV depth, bow & warp and individual layer TTV of a stack measurement as each interface is detected in the right order over a larger range than spectral interferometry. The only limitation is the minimum measurable thickness due to the high coherence length of the IR LED source.

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Combined Core Competencies Deliver comprehensive Inspection and Metrology Offering for FULL SPECTRUM OF SEMICONDUCTOR APPLICATIONS

Grenoble, France – March 20, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced it acquired 100% of the shares of HSEB Dresden, GmbH (HSEB), a leading supplier in optical inspection, review and metrology for high-value semiconductor applications. Following the acquisition, the new entity’s extended line of leading-edge process control solutions will provide a unique and essential inspection and metrology capability to semiconductor manufacturers. Together, the entity’s offerings span substrate, front-end-of-line (FEOL) manufacturing, wafer-level packaging, 3D ICs and power semiconductors. Further, bringing together the two companies will strengthen worldwide customer support for all platforms.

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Event dates: May 29, 2018 - June 1, 2018

2018 IEEE 68th Electronic Components and Technology Conference

San Diego, California
This year again, UnitySC is proud to be Gold Sponsor of ECTC which brings together around 1,500 professionals from the global microelectronics packaging industry, for four consecutive days packed with Technical presentations. We will be exhibiting in booth #406. Go to our contact form to arrange a meeting with our team!

Event dates: March 5, 2018 - March 8, 2018

IMAPS Device Packaging 2018

Fountain Hills, Arizona
UnitySC will be exhibiting on booth #60. Dario Alliata, Product Manager will also deliver two talks respectively entitled Progress in Time-Domain Optical Coherence Tomography for TSV/3Di stacking Metrology and Wafer Nano Topography and Edge Roll-Off Metrology for 3D Monolithic Integration. Come to meet with us! And if you wish to pre-arrange a meeting, send us a message.

Event dates: December 5, 2017 - December 7, 2017

3D Architectures for Heterogeneous Integration and Packaging (3D ASIP)

San Francisco, USA

Gilles Fresquet, CEO UnitySC, will deliver an invited talk entitled “TSV, FOWLP, Hybrid Bonding : Review of Metrology Challenges and Solutions to Support HVM”. Check the event website for more information.

Article published in Silicon Semiconductor (Volume 39, Issue 4 2017)

Thin and ultrathin ICs are in high demand, but yield that sacrifices reliability has little value. Inspection process control can be the solution, according to UnitySC. By Gilles Fresquet, CEO, UnitySC. Read the full article in page 40.

有人已经考虑将暗视野检测用于检测薄晶圆缺陷。基于光学技术,暗视野是指进行较低角度反射光测量。 暗视野对于晶圆前端检测是有效的,但是由于研磨造成晶圆背面粗糙,对于背面检测它是无效的。因此,晶圆背面研磨后应避免暗视野检测。

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Francoise von Trapp (3D Incites) refers to UnitySC’s latest announcement in her coverage of IWLPC.

After reading the announcement of UnitySC’s opening of its new software development lab and customer support demo lab, I caught up with the Philippe Gastaldo, Product and R&D Director, UnitySC, at IWLPC, who filled me in on the details. […]

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UnitySC delivers visionary technologies that foster progress for people. We are recognized as a key player in inspection and metrology combining advanced technologies to enable higher yields and faster time to market.

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