Event dates: October 9, 2017 - October 12, 2017
UnitySC will be exhibiting on booth #421 and delivering a talk entitled “In line Advanced Process Control Solution for the Fabrication of Micro-bumps”. Come to meet with us. To pre-arrange a meeting, send us a message.
Event dates: October 24, 2017 - October 26, 2017
San Jose, CA
Wafer Level Packaging is almost everywhere: smartphones, automotive, IoT, medtech, etc…
Meet with us at IWLPC on booth #10 and listen to our talk entitled “Wafer Thinning In-Line Inspection Process Control Solution for High Volume Manufacturing”. To pre-arrange a meeting, send us a message.
Event dates: September 20, 2017 - September 22, 2017
3rd edition of the SEMI MEMS and Sensor Summit will take place in Grenoble from Sept 20th to 22nd. Looking for versatile process control solutions compliant with high volume manufacturing ? Stop by our booth #21 to learn about our TMap Series and 4See Series. To pre-arranged a meeting, send us a message.
Event dates: September 13, 2017 - September 15, 2017
Taipei Nangang Exhibition Center, Taiwan
Taiwan is a key region for UnitySC with many customers and tools installed. From Sept 13 to 15th, we will be co-exhibiting with our local representative, Kingyoup Entreprises. Visit us on booth #930, 4th floor, and learn more about our innovative product lines. To pre-arrange a meeting at the show, send us a message.
Event dates: July 11, 2017 - July 13, 2017
San Francisco, CA
1 year ago, UnitySC was launched at SEMICON West 2016. What a busy year with so many achievements since July 2016! Stop by our booth to learn about our full advanced process control product portfolio for heterogeneous integration. UnitySC will be exhibiting on the SEMI European Pavilion located on North Hall, booth #6468.
Go to our contact form to arrange a meeting with our team.
Event dates: April 20, 2017 - April 21, 2017
Dario Alliata, Product Manager, will deliver a talk entitled “Advanced Packaging Process Control for High Volume Manufacturing“. In addition, our Business Development team will be attending to meet with attendees and promote our product offer.
Event dates: May 31, 2017 - June 1, 2017
Lake Buena Vista, Florida
ECTC is the premier international conference on microelectronic packaging, components, and systems technology. UnitySC is proud to be Gold Sponsor of ECTC. We will be exhibiting in booth #219 and showcasing our full product portfolio of advanced process control solutions. Go to our contact form to arrange a meeting with our team and stop by our booth.
Event dates: March 14, 2017 - March 17, 2017
Shanghai New Expo International Center
UnitySC will be exhibiting in booth #5375 in Hall #5. New product launch planned !
Event dates: March 6, 2017 - March 9, 2017
Fountain Hills, AZ, USA
UnitySC will be sponsoring the Panel discussion about Fan Out Wafer Level Packaging. Please attend this session and get in touch with our staff during the event.
Event dates: February 8, 2017 - February 10, 2017
UnitySC will be co-exhibiting in booth #1778 with 3H Corporation.
Event dates: January 23, 2017 - January 25, 2017
UnitySC will be demonstrating its TSV and FOWLP product offer. Stop by our booth #18