May 16, 2017
Advanced packaging is now mainstream, but making sure these devices work properly while also cutting costs is getting harder. As advanced packaging moves into the mainstream, packaging houses and equipment makers are ratcheting up efforts to solve persistent metrology and inspection issues. The goal is to lower the cost of fan-outs, 2.5D and 3D-IC, along with a number of other packaging variants consistent with the kinds of gains that are normally associated with Moore’s Law. [Semiconductor Engineering]
Leading IDM Selects New 4See Series Automated Defect Inspection Platform for Power Semiconductor Automotive Applications
Grenoble, France, May 9, 2017 – UnitySC, a leader in advanced inspection and metrology solutions, today announced multiple orders from a leading integrated device manufacturer (IDM) for its modular 4See Series automated defect inspection platform. The systems were selected because they deliver optimal wafer backside surface and edge defect inspection post thinning and metallization. The 4See Series will be used for automotive applications by a market leader in power semiconductor manufacturing to improve the reliability and performance of its products.
Metrology and inspection company Unity Semiconductor SAS (Grenoble, France), is experiencing strong growth and expects to double its sales year-on-year in 2017. We asked CEO Gilles Fresquet to explain why and provide some background. [eeNews Europe]
March 14, 2017
NST Series Provides Non-Contact Full Field Profilometry to 0.1nm Resolution; Delivers Unique Overlay Solution for Hybrid Bonding
Grenoble, France, March 14, 2017 – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today introduced its new NST Series at SEMICON China in Shanghai. The NST Series is the world’s first non-contact metrology solution for accurately measuring the nanoscale surface topography of semiconductor wafers in high-volume manufacturing.The new platform enables higher wafer yields and throughputs, and targets advanced processes being implemented for next-generation image sensor and memory technologies.
February 14, 2017
2016 will be remembered as the year fan-out wafer level packaging (FOWLP) went mainstream, thanks to TSMC’s strategic move in the advanced packaging arena and especially its integrated fan-out (InFO) win inside the iPhone 7. Already in high-volume manufacturing (HVM), FOWLP volumes significantly increased in magnitude. Will this strong momentum continue over the next few years? I believe it will. [3DInCites]
In April 2016, Fogale Nanotech Group acquired the assets of Altatech Semiconductor from Soitec in order to combine the metrology offerings of Fogale Nanotech Semicon with Altatech’s unique 2D and 3D inspection capabilities. The idea was to create a powerhouse of process control for emerging advanced packaging processes for next-generation fan-out wafer-level packaging (FOWLP), 2.5D interposer, 3D through silicon vias (3D TSVs), MEMS, and more. [3DInCites]
January 23, 2017
Grenoble, France, Jan. 23, 2017 – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today announced the opening of its global headquarters in Grenoble, France, the heart of the French Silicon Valley.
August 2, 2016
Every year at SEMICON West, in addition to taking in keynotes and technology sessions, I like to catch up with semiconductor suppliers to find out about any significant news, their latest offerings and how they are enabling next-generation manufacturing. Here are this year’s highlights. [SEMI]
April 15, 2016
Delivering leading-edge full process control tools and software for advanced semiconductor manufacturing & enabling more than Moore to become a reality
Nimes, France, April 15, 2016 – FOGALE Nanotech today announced that it has acquired Altatech, a specialized technology leader in the development of wafer inspection and material deposition tools for semiconductor manufacturing. Altatech SAS has headquarters in Grenoble, France, located in the center of the French Silicon Valley with a commercial subsidiary in Germany.