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Most would agree that in order for advanced packaging solutions to lead the industry and fill the role previously held by semiconductor scaling it must see advances in infrastructure building and significant focus by all players to lower costs. For sure, this will take total industry unity. With this cheap play on words we are led to todays topic… A few blogs ago (see IFTLE 332: “Wither Goest the Toshiba NAND business; Unity SC”) we mentioned that Fogale’s semiconductor division had become UnitySC. This week, we’d like to take a closer look at what this means to the advanced packaging industry [Solid State Technology].

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Gilles Fresquet, CEO of UnitySC, mentionned in the article written by Francoise von Trapp for 3DInCites.
[…] UnitySC filled me in on their most recent inspection platform targeting heterogeneous integration, the 4See Series, an all-surface wafer inspection system designed as a completed solution for 2D and 3D optical and edge inspection. According to Unity’s Gilles Fresquet, it’s the only inspection platform that can be configured to inspect all around and through the wafer. The platform features a deflector module that uses phase shift deflectometry for wafer surface inspection, an edge and line-scan modules that rely on confocal chromatic technology […] [3DInCites]

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Gilles Fresquet, CEO of UnitySC, mentionned in the article written by Francoise von Trapp for 3DInCites.

The fan-out conversation that started at IMAPS DPC 2017 in March continued this week at the annual Electronics Components Technology Conference (ECTC), which took place in Orlando at the Walt Disney World Swan and Dolphin Resort. The buzz started during the Tuesday evening plenary session, where panelists Douglas Yu, TSMC, Tim Olson, Deca Technologies; Steffen Kroehnert, NANIUM; Rolf Aschenbrenner, Fraunhofer IZM; and Steve Bezuk, Qualcomm Technologies, Inc. discussed the why, how and when of panel-level fan out (PLFO) [3DIncites].

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What is expected from inspection and metrology equipment, and how will it evolve in the future?

Advanced packaging has grown into a complex ecosystem with a variety of business models and a series of players involved, from initial wafer processing steps to final package delivery and subsequent board assembly. The spotlight has turned to advanced packaging as one of the solutions to bring further value to the semiconductor product in terms of cost reduction and functionality increase […]. Our lead analysts for the areas of equipment and materials sat down with UnitySC CEO Gilles Fresquet and Global Marketing Manager Yann Guillou to discuss the trends in advanced packaging and their impact on inspection and metrology tools [I-Micronews].

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Advanced packaging is now mainstream, but making sure these devices work properly while also cutting costs is getting harder. As advanced packaging moves into the mainstream, packaging houses and equipment makers are ratcheting up efforts to solve persistent metrology and inspection issues. The goal is to lower the cost of fan-outs, 2.5D and 3D-IC, along with a number of other packaging variants consistent with the kinds of gains that are normally associated with Moore’s Law. [Semiconductor Engineering]

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Metrology and inspection company Unity Semiconductor SAS (Grenoble, France), is experiencing strong growth and expects to double its sales year-on-year in 2017. We asked CEO Gilles Fresquet to explain why and provide some background. [eeNews Europe]

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2016 will be remembered as the year fan-out wafer level packaging (FOWLP) went mainstream, thanks to TSMC’s strategic move in the advanced packaging arena and especially its integrated fan-out (InFO) win inside the iPhone 7. Already in high-volume manufacturing (HVM), FOWLP volumes significantly increased in magnitude. Will this strong momentum continue over the next few years? I believe it will. [3DInCites]

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In April 2016, Fogale Nanotech Group acquired the assets of Altatech Semiconductor from Soitec in order to combine the metrology offerings of Fogale Nanotech Semicon with Altatech’s unique 2D and 3D inspection capabilities. The idea was to create a powerhouse of process control for emerging advanced packaging processes for next-generation fan-out wafer-level packaging (FOWLP), 2.5D interposer, 3D through silicon vias (3D TSVs), MEMS, and more. [3DInCites]

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Every year at SEMICON West, in addition to taking in keynotes and technology sessions, I like to catch up with semiconductor suppliers to find out about any significant news, their latest offerings and how they are enabling next-generation manufacturing. Here are this year’s highlights. [SEMI]

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UnitySC delivers visionary technologies that foster progress for people. We are recognized as a key player in inspection and metrology combining advanced technologies to enable higher yields and faster time to market.

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