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Grenoble, France (November 8, 2018)— UnitySC European leader and a key player in inspection and metrology solutions, today launched the Unity_LIGHTiX ™ system for micro/macro all surface inspection and 2D/3D metrology. This new inspection and metrology system has been designed to address multiple applications including redistribution layers (RDL) down to 2/2 µm line/space, as well as µbump inspection that are expected in wafer-level chip scale packages (WLCSP) and fan-out wafer level packages (FOWLP).

The system also enables high throughput as a solution for high volume manufacturing (HVM), in comparison with the solutions on the market today. Unity_LIGHTiX solution can also support the control of manufacturing processes at OSATs, foundry, and IDMs.

Detecting shorts and opens on RDL and residues on bump top and bond-pads that lead to field failures remains a major challenge or device makers today. The Unity_LIGHTiX system leverages expertise from recent acquisitions that are now fully integrated into UnitySC to secure the best process control for the HVM environment. The system can be configured to inspect wafers up to 300mm, including thin wafers, reconstructed wafers, and wafers mounted on dicing frames.

The combination of line-scan technologies and confocal chromatic techniques allows for 2D and 3D inspection for the front side of the wafer and 2D for backside and edge. With newly designed illumination optics and proprietary defect classification algorithms, Unity_LIGHTiX system eliminates false defects generated from the metal grains on RDL and bumps and enhances the defect detection of true defects of interest.

“We are proud at UnitySC to announce the release of the newly designed process control solution and our leadership in this market segment. This new product will contribute significantly to position UnitySC as the market leader of customer-oriented solutions for the advanced packaging arena and a partner to secure challenging manufacturing processes” said CEO of Unity SC Kamel Ait-Mahiout.

Source: 3dincites.com

Unity Semiconductor Limited Company Will Provide Application Engineering and Field Service Support to Local Customers

Hsinchu, Taiwan – May 8, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced the opening of its Asia subsidiary, Unity Semiconductor Limited Company (UnitySC Asia). The entity was established to deliver enhanced customer support for UnitySC’s growing installed base of inspection and metrology tools throughout the region. UnitySC Asia is headquartered at Tai-Yuan Hi-Tech Industrial Park, Jubei City, Hsinchu, Taiwan, and has field offices in Singapore, Korea, and Shanghai, as well as a presence in Japan.

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Grenoble, France – April 17, 2018 – UnitySC, a leader in advanced inspection and metrology solutions for the semiconductor and related industries, today announced that its board of directors has appointed Kamel Ait-Mahiout as chief executive officer. He has also been elected to serve on UnitySC’s board. Following the company’s recent announcement of the acquisition of HSEB Dresden, GmbH, this appointment marks the next step of the company’s aggressive growth strategy for its process control solutions.

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Grenoble, France – March 20, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced it acquired 100% of the shares of HSEB Dresden, GmbH (HSEB), a leading supplier in optical inspection, review and metrology for high-value semiconductor applications. Following the acquisition, the new entity’s extended line of leading-edge process control solutions will provide a unique and essential inspection and metrology capability to semiconductor manufacturers. Together, the entity’s offerings span substrate, front-end-of-line (FEOL) manufacturing, wafer-level packaging, 3D ICs and power semiconductors. Further, bringing together the two companies will strengthen worldwide customer support for all platforms.

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New Facility Enhances Company’s Semiconductor Process Control Capabilities and Supports Growing North America Customer Base

Austin, Texas – Oct. 23, 2017UnitySC today announced at the International Wafer Level Packaging Conference (IWLPC) in San Jose, Calif., the opening of Unity Semiconductor Inc., the company’s new global software development center and North America customer demonstration lab located in Austin, Texas. The new facility serves as the company’s main center for software development, and will house the full line of UnitySC metrology and inspection tools. This equipment will provide a demo lab that supports UnitySC’s North America customer base, augmenting the primary demo lab at the company’s global headquarters, located in Grenoble, France.

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Leading IDM Selects New 4See Series Automated Defect Inspection Platform for Power Semiconductor Automotive Applications

Grenoble, France, May 9, 2017UnitySC, a leader in advanced inspection and metrology solutions, today announced multiple orders from a leading integrated device manufacturer (IDM) for its modular 4See Series automated defect inspection platform. The systems were selected because they deliver optimal wafer backside surface and edge defect inspection post thinning and metallization. The 4See Series will be used for automotive applications by a market leader in power semiconductor manufacturing to improve the reliability and performance of its products.

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NST Series Provides Non-Contact Full Field Profilometry to 0.1nm Resolution; Delivers Unique Overlay Solution for Hybrid Bonding

Grenoble, France, March 14, 2017 – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today introduced its new NST Series at SEMICON China in Shanghai. The NST Series is the world’s first non-contact metrology solution for accurately measuring the nanoscale surface topography of semiconductor wafers in high-volume manufacturing.The new platform enables higher wafer yields and throughputs, and targets advanced processes being implemented for next-generation image sensor and memory technologies.

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Grenoble, France, Jan. 23, 2017 – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today announced the opening of its global headquarters in Grenoble, France, the heart of the French Silicon Valley.

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Delivering leading-edge full process control tools and software for advanced semiconductor manufacturing & enabling more than Moore to become a reality

Nimes, France, April 15, 2016 – FOGALE Nanotech today announced that it has acquired Altatech, a specialized technology leader in the development of wafer inspection and material deposition tools for semiconductor manufacturing. Altatech SAS has headquarters in Grenoble, France, located in the center of the French Silicon Valley with a commercial subsidiary in Germany.

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UnitySC delivers visionary technologies that foster progress for people. We are recognized as a key player in inspection and metrology combining advanced technologies to enable higher yields and faster time to market.

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