October 23, 2017
New Facility Enhances Company’s Semiconductor Process Control Capabilities and Supports Growing North America Customer Base
Austin, Texas – Oct. 23, 2017 – UnitySC today announced at the International Wafer Level Packaging Conference (IWLPC) in San Jose, Calif., the opening of Unity Semiconductor Inc., the company’s new global software development center and North America customer demonstration lab located in Austin, Texas. The new facility serves as the company’s main center for software development, and will house the full line of UnitySC metrology and inspection tools. This equipment will provide a demo lab that supports UnitySC’s North America customer base, augmenting the primary demo lab at the company’s global headquarters, located in Grenoble, France.
Leading IDM Selects New 4See Series Automated Defect Inspection Platform for Power Semiconductor Automotive Applications
Grenoble, France, May 9, 2017 – UnitySC, a leader in advanced inspection and metrology solutions, today announced multiple orders from a leading integrated device manufacturer (IDM) for its modular 4See Series automated defect inspection platform. The systems were selected because they deliver optimal wafer backside surface and edge defect inspection post thinning and metallization. The 4See Series will be used for automotive applications by a market leader in power semiconductor manufacturing to improve the reliability and performance of its products.
March 14, 2017
NST Series Provides Non-Contact Full Field Profilometry to 0.1nm Resolution; Delivers Unique Overlay Solution for Hybrid Bonding
Grenoble, France, March 14, 2017 – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today introduced its new NST Series at SEMICON China in Shanghai. The NST Series is the world’s first non-contact metrology solution for accurately measuring the nanoscale surface topography of semiconductor wafers in high-volume manufacturing.The new platform enables higher wafer yields and throughputs, and targets advanced processes being implemented for next-generation image sensor and memory technologies.
January 23, 2017
Grenoble, France, Jan. 23, 2017 – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today announced the opening of its global headquarters in Grenoble, France, the heart of the French Silicon Valley.
April 15, 2016
Delivering leading-edge full process control tools and software for advanced semiconductor manufacturing & enabling more than Moore to become a reality
Nimes, France, April 15, 2016 – FOGALE Nanotech today announced that it has acquired Altatech, a specialized technology leader in the development of wafer inspection and material deposition tools for semiconductor manufacturing. Altatech SAS has headquarters in Grenoble, France, located in the center of the French Silicon Valley with a commercial subsidiary in Germany.