Combining multiple measurement technologies in one system, UnitySC's unique “swiss army knife” design, is the only solution that can measure from nanometers to millimeters on silicon as well as thick compound and all other substrates.

Utilizing UnitySC's patented dual head technology, complete thickness of the device, tape / device / backside of the substrate in one measurement is achieved

This allows us to cover a large variety of metrology applications such as:

These products and solutions are designed to help fabs accelerate their development and production ramp cycles.