Advanced packaging

UnitySC is the only complete solution for metrology process control for 3DIC TSV and FOWLP

Combining multiple measurement technologies in one system, UnitySC’s unique “swiss army knife” design, is the only solution that can measure from nanometers to millimeters on silicon, as well as thick compound and all other substrates.

Utilizing patented IR time domain interferometric techniques, UnitySC can measure multiple layer stacks and differentiate each layer in the order that they are placed.

Even under highly warped conditions, UnitySC’s state of the art design provides dependable measurement where and when you need it.

Unique value: