UnitySC delivers the only solution for measuring the full stack on various substrate types before thinning (highly doped SOI, GaN, etc.)
UnitySC performs bonded wafer inspection and wafer centricity while measuring thickness on one system.
- Measurement of the complete stack on various substrate types
- Thickness measurement range from nanometers to millimeters in one system
- Surface profiling from sub nanometers to millimeters
- Thickness, TTV, bow, warp in one measurement
- Infrared inspection and metrology performed at the same time in one shot
- Ability to separate shape from roughness