UnitySC is considered the best in class for gage capability for wafer thinning!
Utilizing UnitySC's Patented Dual head technology, complete thickness of the device, tape / device / backside of the substrate in one measurment is acheived
- Thickness measurement range from nanometers to millimeters in one system
- 0,1 nm resolution for roughness measurement
- Surface profiling from sub nanometers to millimeters
- Thickness, TTV, bow, warp in one measurement
- Can handle any wafer thickness – no minimum
- One system capable of handling all types of wafers : Taico, bonded wafers, wafers on dicing frame, wafers on carriers