Upcoming events


May 31 - June 1, 2017
Lake Buena Vista, Florida

UnitySC is proud to be Gold Sponsor of ECTC. We will be exhibiting in booth #219.

Past events


March 14-16, 2017
Shanghai New Expo International Center

UnitySC will be exhibiting in booth #5375 in Hall #5. New product launch planned !

IMAPS Device Packaging Conference

March 6-9, 2017
Fountain Hills, AZ, USA

UnitySC will be sponsoring the Panel discussion about Fan Out Wafer Level Packaging. Please attend this session and get in touch with our staff during the event.


Feb 8-10, 2017
COEX, Seoul

UnitySC will be co-exhibiting in booth #1778 with 3H Corporation.

SEMI European 3D Summit

Jan 23-25, 2017
Grenoble, France

UnitySC will be demonstrating its TSV and FOWLP product offer. Stop by our booth #18

SEMICON Japan 2016

Dec 14-16, 2016
Tokyo Big Sight

Visit us on booth #5728

SEMICON West 2016

July 12-14, 2016
Moscone Center, San Francisco

Launching of UnitySC brand ! Visit us on the SEMI European Pavilion