Unity in the news

14 February 2017
Process Control Gains Importance in Advanced Packaging Applications
2016 will be remembered as the year fan-out wafer level packaging (FOWLP) went mainstream, thanks to TSMC’s strategic move in the advanced packaging arena and especially its integrated fan-out (InFO) win inside the iPhone 7. Already in high-volume manufacturing (HVM), FOWLP volumes significantly increased in magnitude. Will this strong momentum continue over the next few years? I believe it will. [3DInCites]

2 February 2017
Welcome to a New Era of Predictive Yield Process Control for Advanced Packaging
In April 2016, Fogale Nanotech Group acquired the assets of Altatech Semiconductor from Soitec in order to combine the metrology offerings of Fogale Nanotech Semicon with Altatech’s unique 2D and 3D inspection capabilities. The idea was to create a powerhouse of process control for emerging advanced packaging processes for next-generation fan-out wafer-level packaging (FOWLP), 2.5D interposer, 3D through silicon vias (3D TSVs), MEMS, and more. [3DInCites]

2 August 2016
SEMICON West 2016: Update from the Semiconductor Suppliers
Every year at SEMICON West, in addition to taking in keynotes and technology sessions, I like to catch up with semiconductor suppliers to find out about any significant news, their latest offerings and how they are enabling next-generation manufacturing. Here are this year’s highlights. [Semi]