phone
+33 (0)456 526 800

UnitySC is developing, manufacturing and marketing advanced process control solutions for heterogeneous integration.

UnitySC product portfolio includes metrology and inspection equipment for the following markets and applicationsĀ :

  • Advanced PackagingĀ : 2.5D & 3D TSV, Fan-Out Wafer Level Packaging, micro-bumping
  • Backside processing (backgrinding, metallization) for power semiconductors
  • Substrates control: Bulk Si, SOI, cavity SOI, transparent
  • Hybrid Cu bonding and Cu CMP
  • MEMS

UnitySC delivers visionary technologies that foster progress for people. We are recognized as a key player in inspection and metrology combining advanced technologies to enable higher yields and faster time to market.

phone
+33 (0)456 526 800