UnitySC is developing, manufacturing and marketing advanced process control solutions for heterogeneous integration.
UnitySC product portfolio includes metrology and inspection equipment for the following markets and applications :
- Advanced Packaging : 2.5D & 3D TSV, Fan-Out Wafer Level Packaging, micro-bumping
- Backside processing (backgrinding, metallization) for power semiconductors
- Substrates control: Bulk Si, SOI, cavity SOI, transparent
- Hybrid Cu bonding and Cu CMP