phone
+33 (0)456 526 800

UnitySC is developping, manufacturing and marketing advanced process control solutions for heterogeneous integration.

UnitySC product portfolio includes metrology and inspection equipment for the following markets and applications :

  • Advanced Packaging : 2.5D & 3D TSV, Fan-Out Wafer Level Packaging, micro-bumping, wafer thinning
  • Substrates control: Bulk Si, SOI, cavity substrates
  • MEMS
  • Cu CMP & Hybrid Cu bonding

UnitySC delivers visionary technologies that foster progress for people. We are recognized as a key player in inspection and metrology combining advanced technologies to enable higher yields and faster time to market.

phone
+33 (0)456 526 800

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