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Hybrid bonding

Hydrid bonding is a direct bonding technology consisting in bonding simultaneously some metal to metal and dielectric to dielectric interfaces. Under development for some years to enable fine pitch interconnect, it took off in the last couple of years for Back Side-Illuminated (BSI) Sensors and MEMS. To ensure a good bonding, surface preparation and flatness are crucial. UnitySC developped a specific solution to address this need with nanotopography and overlay measurements.

CMP

CMP is a well established process in semiconductor manufacturing in both FEOL and BEOL. With advanced technologies, planarity requirements  are becoming more and more stringent for ICs. UnitySC developped a disruptive solution to measure the surface nanotopography. This solution is well suited for CMP related to STI and interconnect.

UNITYSC’S solution: NST Series

NST Series is an automatic full field optical microcopy solution performing nanotopography measurements. Unique on the market, NST Series does not required specific surface preparations of the wafer to provide accurate results with vertical resolution down to 0.1nm and lateral resolution down to 0.2µm. Specific to hybrid bonding applications, it has unique in and out of plane overlay features and capability to measure the edge roll off up the extreme edge of the wafer.

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UnitySC delivers visionary technologies that foster progress for people. We are recognized as a key player in inspection and metrology combining advanced technologies to enable higher yields and faster time to market.

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+33 (0)456 526 800