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  • TMAP SERIES IS A VERSATILE METROLOGY SOLUTION TMap Series provides highly accurate and repeatable wafer geometry measurements. TMap Series was designed to enable the easiest and fastest measurement for the user. TMap Series is available in manual, semi-automatic or full automatic configurations for wafers up to 300mm. Examples of measurements TTV on Epoxy Mold Compound

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  • NST SERIES – A GAME CHANGER IN NANOTOPOGRAPHY The NST Series is a non-contact, full field metrology solution. The NST Series is pushing the boundaries of conventional microscopy with performances that stretch beyond contact profilometry and into the AFM space. Examples of measurements Wafer to wafer bonding overlay     NST Series is composed of

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  • 4SEE SERIES – MODULAR PLATFORM FOR ALL SURFACE INSPECTION: TOP, BOTTOM, EDGE The 4See Series ensures wafer front side, backside and edge quality by detecting, counting, and binning particles and defects during the wafer manufacturing process. The 4See Series is built on a modular approach allowing to combine several modules depending on the customer needs.

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UnitySC delivers visionary technologies that foster progress for people. We are recognized as a key player in inspection and metrology combining advanced technologies to enable higher yields and faster time to market.

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+33 (0)456 526 800