4See Series – Modular Platform for All Surface Inspection : Top, Bottom, Edge
The 4See Series ensures wafer front side, backside and edge quality by detecting, counting, and binning particles and defects during the wafer manufacturing process.
- Wafer Thinning
- Substrates Control
- Phase Shift Deflectometry
- Line Scan Confocal Chromatic
The 4See Series is built on a modular approach allowing to combine several modules depending on the customer needs.
- High depth of focus
- High resolution
- Multi line scan
- Strong topography can be inspected
- Low sensitivity to bow/warp
- Passive autofocus by design
- Nanometer topographical sensitivity with full field of view
- High Throughput
- Simultaneous double side inspection
- Full wafer edge surface inspection at high speed
- Top surface, top bevel, APEX, bottom bevel, Bottom surface
- Near edge inspection possible
4SeeSeries features an Automatic Defect Classification software that automatically classifies defects on the wafer and generates reports.
Automatic Classification Software (ADC)
A Global Solution for Defect Detection, Analysis, Classification and Review.
For additional information, contact us.