4SEE SERIES – MODULAR PLATFORM FOR ALL SURFACE INSPECTION: TOP, BOTTOM, EDGE
The 4See Series ensures wafer
front side, backside and edge quality by detecting, counting, and binning particles and defects during the wafer manufacturing process. Applications Wafer Thinning Substrates Control Micro-bumping Interconnect MEMS Technologies Phase Shift Deflectometry Line Scan Confocal Chromatic The 4See Series is built on a modular approach allowing to combine several modules depending on the customer needs. LineScan module High depth of focus High resolution Multi line scan Strong topography can be inspected Low sensitivity to bow/warp Passive autofocus by design Deflector module Nanometer topographical sensitivity with full field of view High Throughput Simultaneous double side inspection
Edge module Full wafer edge surface inspection at high speed Top surface, top bevel, APEX, bottom bevel, Bottom surface Near edge inspection possible 4SeeSeries features an Automatic Defect Classification software that automatically classifies defects on the wafer and generates reports. Automatic Classification Software (ADC)
A Global Solution for Defect Detection, Analysis, Classification and Review.
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