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The NST Series is a non-contact, full field metrology solution. The NST Series is pushing the boundaries of conventional microscopy with performances that stretch beyond contact profilometry and into the AFM space.

Key benefits

  • Cu CMP
  • Hybrid Cu bonding
  • Front-end CMP
  • Front-end etch


  • Phase Shifting Interferometry (PSI)
  • Vertical Scanning Interferometry (VSI)
  • Time domain IR spectroscopy
  • IR microscopy

Examples of measurements

Post CMP Nanotopography and Wafer Edge Roll Off

µbump and PI over RDL

Wafer to wafer bonding overlay



NST Series is composed of 2 distinct products


A versatile, high speed, and high precision sub nanometer non contact full field profilometry solution. Flexible architecture to provide a wide range of profiling metrology measurements. Not sensitive to transparent layer artifacts due to its patented technologies.

  • Nano topography
  • Dishing and erosion
  • CD and step height
  • Roughness
  • Deep trench
  • TTV, Bow, warp

NST Bond

A complete metrology solution for hybrid bonding: Non contact full field profilometry post Cu CMP for dishing and erosion and post Cu to Cu bonding. Allowing high accuracy direct measurements without the need of surface metallization.

  • All NST XP measurements and applications
  • High resolution in and out of the plane overlay

For additional information, contact us.

UnitySC delivers visionary technologies that foster progress for people. We are recognized as a key player in inspection and metrology combining advanced technologies to enable higher yields and faster time to market.

+33 (0)456 526 800