The NST Series is a non-contact, full field metrology solution. The NST Series is pushing the boundaries of conventional microscopy with performances that stretch beyond contact profilometry and into the AFM space.
A versatile, high speed, and high precision sub nanometer non contact full field profilometry solution. Flexible architecture to provide a wide range of profiling metrology measurements. Not sensitive to transparent layer artifacts due to its patented technologies.
A complete metrology solution for hybrid bonding: Non contact full field profilometry post Cu CMP for dishing and erosion and post Cu to Cu bonding. Allowing high accuracy direct measurements without the need of surface metallization.
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