In April 2016, Fogale Nanotech Group acquired the assets of Altatech Semiconductor from Soitec in order to combine the metrology offerings of Fogale Nanotech Semicon with Altatech’s unique 2D and 3D inspection capabilities. The idea was to create a powerhouse of process control for emerging advanced packaging processes for next-generation fan-out wafer-level packaging (FOWLP), 2.5D interposer, 3D through silicon vias (3D TSVs), MEMS, and more. [3DInCites]
Welcome to a New Era of Predictive Yield Process Control for Advanced Packaging
Feb 2, 2017