November 20, 2018
Grenoble, France (November 8, 2018)— UnitySC European leader and a key player in inspection and metrology solutions, today launched the Unity_LIGHTiX ™ system for micro/macro all surface inspection and 2D/3D metrology. This new inspection and metrology system has been designed to address multiple applications including redistribution layers (RDL) down to 2/2 µm line/space, as well as µbump inspection that are expected in wafer-level chip scale packages (WLCSP) and fan-out wafer level packages (FOWLP).
The system also enables high throughput as a solution for high volume manufacturing (HVM), in comparison with the solutions on the market today. Unity_LIGHTiX solution can also support the control of manufacturing processes at OSATs, foundry, and IDMs.
Detecting shorts and opens on RDL and residues on bump top and bond-pads that lead to field failures remains a major challenge or device makers today. The Unity_LIGHTiX system leverages expertise from recent acquisitions that are now fully integrated into UnitySC to secure the best process control for the HVM environment. The system can be configured to inspect wafers up to 300mm, including thin wafers, reconstructed wafers, and wafers mounted on dicing frames.
The combination of line-scan technologies and confocal chromatic techniques allows for 2D and 3D inspection for the front side of the wafer and 2D for backside and edge. With newly designed illumination optics and proprietary defect classification algorithms, Unity_LIGHTiX system eliminates false defects generated from the metal grains on RDL and bumps and enhances the defect detection of true defects of interest.
“We are proud at UnitySC to announce the release of the newly designed process control solution and our leadership in this market segment. This new product will contribute significantly to position UnitySC as the market leader of customer-oriented solutions for the advanced packaging arena and a partner to secure challenging manufacturing processes” said CEO of Unity SC Kamel Ait-Mahiout.
Unity Semiconductor Limited Company Will Provide Application Engineering and Field Service Support to Local Customers
Hsinchu, Taiwan – May 8, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced the opening of its Asia subsidiary, Unity Semiconductor Limited Company (UnitySC Asia). The entity was established to deliver enhanced customer support for UnitySC’s growing installed base of inspection and metrology tools throughout the region. UnitySC Asia is headquartered at Tai-Yuan Hi-Tech Industrial Park, Jubei City, Hsinchu, Taiwan, and has field offices in Singapore, Korea, and Shanghai, as well as a presence in Japan.
April 17, 2018
Ait-Mahiout Brings Strong Track Record of Growth at Amkor Europe and Significant Operational Experience
Grenoble, France – April 17, 2018 – UnitySC, a leader in advanced inspection and metrology solutions for the semiconductor and related industries, today announced that its board of directors has appointed Kamel Ait-Mahiout as chief executive officer. He has also been elected to serve on UnitySC’s board. Following the company’s recent announcement of the acquisition of HSEB Dresden, GmbH, this appointment marks the next step of the company’s aggressive growth strategy for its process control solutions.
April 3, 2018
Time-domain Optical Coherence is the most robust solution for TSV depth, bow & warp and individual layer TTV of a stack measurement as each interface is detected in the right order over a larger range than spectral interferometry. The only limitation is the minimum measurable thickness due to the high coherence length of the IR LED source.
March 20, 2018
Grenoble, France – March 20, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced it acquired 100% of the shares of HSEB Dresden, GmbH (HSEB), a leading supplier in optical inspection, review and metrology for high-value semiconductor applications. Following the acquisition, the new entity’s extended line of leading-edge process control solutions will provide a unique and essential inspection and metrology capability to semiconductor manufacturers. Together, the entity’s offerings span substrate, front-end-of-line (FEOL) manufacturing, wafer-level packaging, 3D ICs and power semiconductors. Further, bringing together the two companies will strengthen worldwide customer support for all platforms.
Article published in Silicon Semiconductor (Volume 39, Issue 4 2017)
Thin and ultrathin ICs are in high demand, but yield that sacrifices reliability has little value. Inspection process control can be the solution, according to UnitySC. By Gilles Fresquet, CEO, UnitySC. Read the full article in page 40.
November 9, 2017
Francoise von Trapp (3D Incites) refers to UnitySC’s latest announcement in her coverage of IWLPC.
After reading the announcement of UnitySC’s opening of its new software development lab and customer support demo lab, I caught up with the Philippe Gastaldo, Product and R&D Director, UnitySC, at IWLPC, who filled me in on the details. […]
October 23, 2017
New Facility Enhances Company’s Semiconductor Process Control Capabilities and Supports Growing North America Customer Base
Austin, Texas – Oct. 23, 2017 – UnitySC today announced at the International Wafer Level Packaging Conference (IWLPC) in San Jose, Calif., the opening of Unity Semiconductor Inc., the company’s new global software development center and North America customer demonstration lab located in Austin, Texas. The new facility serves as the company’s main center for software development, and will house the full line of UnitySC metrology and inspection tools. This equipment will provide a demo lab that supports UnitySC’s North America customer base, augmenting the primary demo lab at the company’s global headquarters, located in Grenoble, France.
Blog post from Philippe Gastaldo, Product and R&D Director, UnitySC.
As the automotive electronics market continues to grow, spurred by developments such as semi-autonomous and fully autonomous vehicles, the demand is increasing for power semiconductor components with sophisticated conversion schemes that decrease power consumption and heat. To address these needs, power semiconductor manufacturers are turning to thin wafers.
Today’s power semiconductors are manufactured primarily on 200-mm wafers that range in thickness from 50 to 100 µm, but their roadmaps are targeting wafers as thin as 1 µm. These wafers are thinned on the backside by mechanical polishing. Defects resulting from the polishing process include grinding marks, grinding failures resulting in edge chips, star cracks and comets formed by edge particles that get caught in the grinding wheel, embedded particles, cleavage lines, and a variety of other imperfections [Evaluation Engineering].