Enabling the “Sixth sense”
The race is on for AI advanced chips.
AI is poised to modify almost every industry
New AI/ML methods are required in order to achieve the required energy efficiency, speed and/or analysis quality on edge devices. With the transition from typical digital signal processing to the new AI methods, AI /ML are today being implemented in digital circuits either in Edge or Cloud Computing depending on the latency requirement.
Discover how Unitysc helps Semiconductors vendors to shorten the time to market of their AI specific Hardware.
Augmented & Virtual reality
Electronic systems in mobiles or wearable devices are becoming increasingly sophisticated and complex, required to perform an expanding list of functions while also becoming smaller and lighter. As a result, pressure is growing to design extremely high-performance chips with lower energy consumption and less sensitivity to harsh environmental conditions.
Discover how Unitysc helps Semiconductors to design edge devices to sustain a new reality.
Internet Of Thing
IoT technology in its ultimate form will consist of an ecosystem of securely hyperconnected devices driving the word of tommorow. Discover how Unitysc help semiconductor vendors accelerating the next IoT generation.
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High Perf. Computing (HPC) & High Band. Memory (HBM)
AI-driven data analytics is based on real-time data processing on a large scale. Discover how Unitysc help Semiconductor industry in optimizing computing and memory architecture so that large data sets and time-critical data can be more efficiently and securely handled.
Automotive
Automation, Electrification, Digital connectivity and advanced security ! All these trends have one common enabler, advances in semiconductor components. Discover how Unitysc can help Semiconductor vendors to reach the ultimate level 5 of the automotive industry.
What’s new
Press releases
Unity SC opens a new location in Germany
UNITY SC OPENS A NEW LOCATION IN GERMANY Montbonnot-Saint-Martin, the 12th of September 2019. Unity SC is deploying rapidly the strategic execution plan to differentiate in the market, and adapting its resources globally to address the fast growth. At the same time,...
GREENTROPISM and UNITYSC’s Collaboration
GreenTropism and UnitySC sign MoU to collaborate tackling Molecular contamination identification on Advance Packaging issues using advanced sensing and artificial intelligence Taiwan, September 17, 2019 - GreenTropism a leading French startup on artificial...
Events
Process Control solutions for Advanced Packaging – Advanced Semiconductor Technology Conference
During the ASTC conference held in Marina Bay Sands Convention Centre - Singapore, the 7th and 8th of November 2019, Unity Semiconductor will present a paper entitled : Process Control solutions for Advanced Packaging You can already read below an abstract of...
“Technologies development driven by MEMS challenges” at MEMS World Summit 2019
Mr Mathieu NOEL, Product Line Manager for Metrology solutions at UnitySC, will present a paper during the MEMS World Summit, the 11th and 12th November 2019 at the Hilton Munich Park Hotel. The paper subject will be "Technologies development driven by MEMS...
News
GREENTROPISM and UNITYSC’s Collaboration
GreenTropism and UnitySC sign MoU to collaborate tackling Molecular contamination identification on Advance Packaging issues using advanced sensing and artificial intelligence Taiwan, September 17, 2019 - GreenTropism a leading French startup on artificial...
Inspection and metrology challenges for power device manufacturing
Driven by automotive market growing, power devices are now requested to fulfill the Zero-Defect policy edicted by Power Device Manufacturers leading the market. Much more than adapting old technologies and equipment to this new challenge, specific solutions are...