Enabling the “Sixth sense”
The race is on for AI advanced chips.
AI is poised to modify almost every industry
New AI/ML methods are required in order to achieve the required energy efficiency, speed and/or analysis quality on edge devices. With the transition from typical digital signal processing to the new AI methods, AI /ML are today being implemented in digital circuits either in Edge or Cloud Computing depending on the latency requirement.
Discover how Unitysc helps Semiconductors vendors to shorten the time to market of their AI specific Hardware.
Augmented & Virtual reality
Electronic systems in mobiles or wearable devices are becoming increasingly sophisticated and complex, required to perform an expanding list of functions while also becoming smaller and lighter. As a result, pressure is growing to design extremely high-performance chips with lower energy consumption and less sensitivity to harsh environmental conditions.
Discover how Unitysc helps Semiconductors to design edge devices to sustain a new reality.
Internet Of Thing
IoT technology in its ultimate form will consist of an ecosystem of securely hyperconnected devices driving the word of tommorow. Discover how Unitysc help semiconductor vendors accelerating the next IoT generation.
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High Perf. Computing (HPC) & High Band. Memory (HBM)
AI-driven data analytics is based on real-time data processing on a large scale. Discover how Unitysc help Semiconductor industry in optimizing computing and memory architecture so that large data sets and time-critical data can be more efficiently and securely handled.
Automotive
Automation, Electrification, Digital connectivity and advanced security ! All these trends have one common enabler, advances in semiconductor components. Discover how Unitysc can help Semiconductor vendors to reach the ultimate level 5 of the automotive industry.
What’s new
Press releases
Inspection and metrology challenges for power device manufacturing
Driven by automotive market growing, power devices are now requested to fulfill the Zero-Defect policy edicted by Power Device Manufacturers leading the market. Much more than adapting old technologies and equipment to this new challenge, specific solutions are...
LIGHTSpEED by UNiTYSC: The new high-end surface inspection solution for in-line monitoring and process qualification of opaque and transparent substrates
The LIGHTSpEED is the first unpatterned surface inspection solution that combines darkfield inspection and advanced synchronous doppler detection technology to capture nanometer scale defects on all kind of wafers. Grenoble, France – Tuesday, July 9th, 2019 – UnitySC,...
Events
LETI Innovation Days
LETI Innovation Days DEEP TECH FOR EDGE ARTIFICIAL INTELLIGENCE Explore the power of distributed artificial intelligence, also called "Edge AI" during the Leti innovation Days on June 24-28, 2019 in Grenoble. Join to trigger the creative part of your brain and create...
13th International Conference on Nitride Semiconductors 2019 (July 7-12, 2019, Washington)
The 13th International Conference on Nitride Semiconductors 2019 will present high-impact scientific and technological advances in materials and devices based on group-III nitride semiconductors, and will feature plenary sessions, parallel topical sessions, poster...
News
Inspection and metrology challenges for power device manufacturing
Driven by automotive market growing, power devices are now requested to fulfill the Zero-Defect policy edicted by Power Device Manufacturers leading the market. Much more than adapting old technologies and equipment to this new challenge, specific solutions are...
LIGHTSpEED by UNiTYSC: The new high-end surface inspection solution for in-line monitoring and process qualification of opaque and transparent substrates
The LIGHTSpEED is the first unpatterned surface inspection solution that combines darkfield inspection and advanced synchronous doppler detection technology to capture nanometer scale defects on all kind of wafers. Grenoble, France – Tuesday, July 9th, 2019 – UnitySC,...