Breaking throught the Computing & Memory wall
Enabling new architectures, applications & services
High Perfermance Computing
Enabling a smart world
High End Performances are a must today to face the need of Data Center, the Cloud and the related High-Speed Network to share data and third part services.To assure the need, Heterogeneous Integration based on 2.5D and/or 3D stacking and vertical electrical interconnections with Through Silicon Vias (TSV) or hybrid bonding was adopted by semiconductor industry and moved in few years from proof of concept to full production in high volume.
With the mission of supporting our customers, at Unitysc we work to anticipate the process control need of today and tomorrow.
High Bandwith Memory
Sustaining the rise of Memory, Towards Ultra HBM
With High-Bandwidth Memory (HBM), an additional opportunity on hardware side for performance benefits is given. Next-generation of supercomputers, graphics systems, and artificial intelligence (AI) systems will require a large amount of available bandwidth compared to regular DRAM allowing the execution of high numbers of threads in parallel masking penalties of concurrent memory accesses.
Discover how Unitysc can help Semiconductors’ R&D department to design new architectures and sustain the HBM wave.
Automotive
Automation, Electrification, Digital connectivity and advanced security ! All these trends have one common enabler, advances in semiconductor components. Discover how Unitysc can help Semiconductor vendors to reach the ultimate level 5 of the automotive industry.
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Internet Of Thing
IoT technology in its ultimate form will consist of an ecosystem of securely hyperconnected devices driving the word of tommorow. Discover how Unitysc helps Semiconductor vendors accelerate the next IoT generation
AI & Extended Reality
Augmented reality and artificial intelligence are distinct technologies, but together they create unique digital experiences. Discover how Unitysc help Semiconductor industry moving the boundaries of the digital world.
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What’s new
Press releases
Paul Boudre appointed chairman of UnitySC
UnitySC, a leading provider of metrology and inspection equipment for the semiconductor industry, is delighted to announce the appointment of Paul Boudre, former CEO of Soitec, as chairman of its board of directors. Paul Boudre was the CEO of Soitec [EPA:SOI], a world...
UnitySC raises EUR 48 million with Jolt Capital, the French State and Supernova Invest
UnitySC, the leading provider of metrology and inspection equipment for the semiconductor industry, today announces a successful EUR 48 million funding round led by Jolt Capital, the French State through French Tech Souveraineté (a program operated by Bpifrance) and...
Events
Meet UnitySC during SEMICON Korea
Mr Sungtae Kim, our Korean Key Account Director, and his team will be ready to meet you at SEMICON Korea, the key meeting on semiconductor market. Then event will be held from the 5th to the 7th of February 2020, at the Korea World Trade Tower, #4205, 511,...
UnitySC in Munich this week
UnitySC was represented during two important events this week : Our Key Account Managers Mr Yves Budillon, and Mr Gilles Vera have hold a booth during the SEMICON Europa in Munich from the 12th to the 15th of November. They have been joined by our Product Line Manager...
News
UnitySC Opens a New Office in South Korea
We are pleased to announce that UnitySC has expanded to open a new office in South Korea ! UnitySC has officially opened a new office in Yongin-si, South Korea, the 28th of October 2019. As part of the strategy and worldwide growth, UnitySC is expanding locally its...
“Technologies development driven by MEMS challenges” at MEMS World Summit 2019
Mr Mathieu NOEL, Product Line Manager for Metrology solutions at UnitySC, will present a paper during the MEMS World Summit, the 11th and 12th November 2019 at the Hilton Munich Park Hotel. The paper subject will be "Technologies development driven by MEMS...