Breaking through the Computing & Memory wall
Enabling new architectures, applications & services
High Performance Computing
Enabling a smart world
High End Performances are a must today to face the need of Data Center, the Cloud and the related High-Speed Network to share data and third part services.To assure the need, Heterogeneous Integration based on 2.5D and/or 3D stacking and vertical electrical interconnections with Through Silicon Vias (TSV) or hybrid bonding was adopted by semiconductor industry and moved in few years from proof of concept to full production in high volume.
With the mission of supporting our customers, at Unitysc we work to anticipate the process control need of today and tomorrow.
High Bandwidth Memory
Sustaining the rise of Memory, Towards Ultra HBM
With High-Bandwidth Memory (HBM), an additional opportunity on hardware side for performance benefits is given. Next-generation of supercomputers, graphics systems, and artificial intelligence (AI) systems will require a large amount of available bandwidth compared to regular DRAM allowing the execution of high numbers of threads in parallel masking penalties of concurrent memory accesses.
Discover how Unitysc can help Semiconductors’ R&D department to design new architectures and sustain the HBM wave.
Automation, Electrification, Digital connectivity and advanced security ! All these trends have one common enabler, advances in semiconductor components. Discover how Unitysc can help Semiconductor vendors to reach the ultimate level 5 of the automotive industry.
IoT technology in its ultimate form will consist of an ecosystem of securely hyperconnected devices driving the word of tommorow. Discover how Unitysc helps Semiconductor vendors accelerate the next IoT generation
Augmented reality and artificial intelligence are distinct technologies, but together they create unique digital experiences. Discover how Unitysc help Semiconductor industry moving the boundaries of the digital world.
UnitySC is delighted to announce the appointment of Léa ALZINGRE, CFO of Soitec, as an independent member of its board of directors and chairwoman of the audit committee. Her history Léa ALZINGRE has been CFO of Soitec since July 2020. Soitec (Euronext Paris)...
UnitySC, a leading provider of metrology and inspection equipment for the semiconductor industry, is delighted to announce the appointment of Paul Boudre, former CEO of Soitec, as chairman of its board of directors. Paul Boudre was the CEO of Soitec [EPA:SOI], a world...
Mark your calendars for November 14-17, 2023, as Munich gears up to host SEMICON EUROPA, a pivotal event in the world of semiconductors. If you're in the industry, this is an opportunity you simply can't afford to miss. The UnitySC European team is thrilled to...
Join the UNITY-SC team at SEMICON EUROPA from November 15-18, 2022 in Munich, a key meeting for the semiconductor market.
UnitySC European team will be pleased to welcome you at booth 160, hall C1, in Messe München, Munich, Germany. Visit us to discover our range of inspection and metrology tools combining advanced technologies used for Unpatterned & Patterned Defect...
UnitySC rejoint France Deeptech en novembre 2023, la communauté qui rassemble les acteurs de la deeptech pour une réponse entrepreneuriale, collective et scientifique à nos défis contemporains
UnitySC est désormais membre officiel de France Deeptech, une association révolutionnaire lancée officiellement le 29 novembre à la BnF Richelieu, sous le patronage distingué de trois ministres éminents – Sylvie Retailleau, Roland Lescure et Jean-Noël Barrot. Ce...
Mohamad’s Journey: From the Application Development field to a Leader & Product Gatekeeper at UnitySC
Mohamad, a former research engineer at CEA Grenoble, discovered UnitySC in 2018 through a collaborative project, capturing his heart and leading him to join as a Junior Application Engineer. Pioneering Role in Metrology Assigned to showcase Metrology tools at...