Breaking throught the Computing & Memory wall
Enabling new architectures, applications & services
High Perfermance Computing
Enabling a smart world
High End Performances are a must today to face the need of Data Center, the Cloud and the related High-Speed Network to share data and third part services.To assure the need, Heterogeneous Integration based on 2.5D and/or 3D stacking and vertical electrical interconnections with Through Silicon Vias (TSV) or hybrid bonding was adopted by semiconductor industry and moved in few years from proof of concept to full production in high volume.
With the mission of supporting our customers, at Unitysc we work to anticipate the process control need of today and tomorrow.
High Bandwith Memory
Sustaining the rise of Memory, Towards Ultra HBM
With High-Bandwidth Memory (HBM), an additional opportunity on hardware side for performance benefits is given. Next-generation of supercomputers, graphics systems, and artificial intelligence (AI) systems will require a large amount of available bandwidth compared to regular DRAM allowing the execution of high numbers of threads in parallel masking penalties of concurrent memory accesses.
Discover how Unitysc can help Semiconductors’ R&D department to design new architectures and sustain the HBM wave.
Automotive
Automation, Electrification, Digital connectivity and advanced security ! All these trends have one common enabler, advances in semiconductor components. Discover how Unitysc can help Semiconductor vendors to reach the ultimate level 5 of the automotive industry.
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Internet Of Thing
IoT technology in its ultimate form will consist of an ecosystem of securely hyperconnected devices driving the word of tommorow. Discover how Unitysc helps Semiconductor vendors accelerate the next IoT generation
AI & Extended Reality
Augmented reality and artificial intelligence are distinct technologies, but together they create unique digital experiences. Discover how Unitysc help Semiconductor industry moving the boundaries of the digital world.
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What’s new
Press releases
UnitySC lève 48M€ auprès de Jolt Capital, l’État via French Tech Souveraineté et Supernova Invest
UnitySC, le leader des équipements de métrologie et d’inspection pour l’industrie des semi-conducteurs, annonce une levée de 48M€ auprès de Jolt Capital, de l’Etat français au travers du fonds French Tech Souveraineté (programme géré par Bpifrance) et de Supernova...
Unity SC opens a new location in Germany
UNITY SC OPENS A NEW LOCATION IN GERMANY Montbonnot-Saint-Martin, the 12th of September 2019. Unity SC is deploying rapidly the strategic execution plan to differentiate in the market, and adapting its resources globally to address the fast growth. At the same time,...
Events
UnitySC at Power Electronics and Packaging Technical Workshop
UnitySC will have a booth during the Power Electronics and Packaging Technical Workshop on the 28th November 2019 in Tours, France. Our Product Managers, Mrs Louise Decoin and our Key Account Diector for South Europe, Mr Gilles Vera, will be there to meet you and...
Process Control solutions for Advanced Packaging – Advanced Semiconductor Technology Conference
During the ASTC conference held in Marina Bay Sands Convention Centre - Singapore, the 7th and 8th of November 2019, Unity Semiconductor will present a paper entitled : Process Control solutions for Advanced Packaging You can already read below an abstract of...
News
Unity SC opens a new location in Germany
UNITY SC OPENS A NEW LOCATION IN GERMANY Montbonnot-Saint-Martin, the 12th of September 2019. Unity SC is deploying rapidly the strategic execution plan to differentiate in the market, and adapting its resources globally to address the fast growth. At the same time,...
GREENTROPISM and UNITYSC’s Collaboration
GreenTropism and UnitySC sign MoU to collaborate tackling Molecular contamination identification on Advance Packaging issues using advanced sensing and artificial intelligence Taiwan, September 17, 2019 - GreenTropism a leading French startup on artificial...