Breaking through the Computing & Memory wall

Enabling new architectures, applications & services




High Performance Computing


Enabling a smart world

High End Performances are a must today to face the need of Data Center, the Cloud and the related High-Speed Network to share data and third part services.To assure the need, Heterogeneous Integration based on 2.5D and/or 3D stacking and vertical electrical interconnections with Through Silicon Vias (TSV) or hybrid bonding was adopted by semiconductor industry and moved in few years from proof of concept to full production in high volume.

With the mission of supporting our customers, at Unitysc we work to anticipate the process control need of today and tomorrow.

High Bandwidth Memory


Sustaining the rise of Memory, Towards Ultra HBM

With High-Bandwidth Memory (HBM), an additional opportunity on hardware side for performance benefits is given. Next-generation of supercomputers, graphics systems, and artificial intelligence (AI) systems will require a large amount of available bandwidth compared to regular DRAM allowing the execution of high numbers of threads in parallel masking penalties of concurrent memory accesses.

Discover how Unitysc can help Semiconductors’ R&D department to design new architectures and sustain the HBM wave.




Automation, Electrification, Digital connectivity and advanced security ! All these trends have one common enabler, advances in semiconductor components. Discover how Unitysc can help Semiconductor vendors to reach the ultimate level 5 of the automotive industry.


Internet Of Thing

IoT technology in its ultimate form will consist of an ecosystem of securely hyperconnected devices driving the word of tommorow. Discover how Unitysc  helps Semiconductor vendors accelerate the next IoT generation

AI & Extended Reality

Augmented reality and artificial intelligence are distinct technologies, but together they create unique digital experiences. Discover how Unitysc  help Semiconductor industry moving the boundaries of the digital world.


What’s new

Press releases


Meet UnitySC during SEMICON Korea

Mr Sungtae Kim, our Korean Key Account Director, and his team will be ready to meet you at SEMICON Korea, the key meeting on semiconductor market. Then event will be held from the 5th to the 7th of February 2020, at the Korea World Trade Tower, #4205, 511,...

UnitySC in Munich this week

UnitySC was represented during two important events this week : Our Key Account Managers Mr Yves Budillon, and Mr Gilles Vera have hold a booth during the SEMICON Europa in Munich from the 12th to the 15th of November. They have been joined by our Product Line Manager...