Breaking throught the Computing & Memory wall
Enabling new architectures, applications & services
High Perfermance Computing
Enabling a smart world
High End Performances are a must today to face the need of Data Center, the Cloud and the related High-Speed Network to share data and third part services.To assure the need, Heterogeneous Integration based on 2.5D and/or 3D stacking and vertical electrical interconnections with Through Silicon Vias (TSV) or hybrid bonding was adopted by semiconductor industry and moved in few years from proof of concept to full production in high volume.
With the mission of supporting our customers, at Unitysc we work to anticipate the process control need of today and tomorrow.
High Bandwith Memory
Sustaining the rise of Memory, Towards Ultra HBM
With High-Bandwidth Memory (HBM), an additional opportunity on hardware side for performance benefits is given. Next-generation of supercomputers, graphics systems, and artificial intelligence (AI) systems will require a large amount of available bandwidth compared to regular DRAM allowing the execution of high numbers of threads in parallel masking penalties of concurrent memory accesses.
Discover how Unitysc can help Semiconductors’ R&D department to design new architectures and sustain the HBM wave.
Automotive
Automation, Electrification, Digital connectivity and advanced security ! All these trends have one common enabler, advances in semiconductor components. Discover how Unitysc can help Semiconductor vendors to reach the ultimate level 5 of the automotive industry.
.
Internet Of Thing
IoT technology in its ultimate form will consist of an ecosystem of securely hyperconnected devices driving the word of tommorow. Discover how Unitysc helps Semiconductor vendors accelerate the next IoT generation
AI & Extended Reality
Augmented reality and artificial intelligence are distinct technologies, but together they create unique digital experiences. Discover how Unitysc help Semiconductor industry moving the boundaries of the digital world.
.
What’s new
Press releases
Inspection and metrology challenges for power device manufacturing
Driven by automotive market growing, power devices are now requested to fulfill the Zero-Defect policy edicted by Power Device Manufacturers leading the market. Much more than adapting old technologies and equipment to this new challenge, specific solutions are...
LIGHTSpEED by UNiTYSC: The new high-end surface inspection solution for in-line monitoring and process qualification of opaque and transparent substrates
The LIGHTSpEED is the first unpatterned surface inspection solution that combines darkfield inspection and advanced synchronous doppler detection technology to capture nanometer scale defects on all kind of wafers. Grenoble, France – Tuesday, July 9th, 2019 – UnitySC,...
Events
LETI Innovation Days
LETI Innovation Days DEEP TECH FOR EDGE ARTIFICIAL INTELLIGENCE Explore the power of distributed artificial intelligence, also called "Edge AI" during the Leti innovation Days on June 24-28, 2019 in Grenoble. Join to trigger the creative part of your brain and create...
13th International Conference on Nitride Semiconductors 2019 (July 7-12, 2019, Washington)
The 13th International Conference on Nitride Semiconductors 2019 will present high-impact scientific and technological advances in materials and devices based on group-III nitride semiconductors, and will feature plenary sessions, parallel topical sessions, poster...
News
Inspection and metrology challenges for power device manufacturing
Driven by automotive market growing, power devices are now requested to fulfill the Zero-Defect policy edicted by Power Device Manufacturers leading the market. Much more than adapting old technologies and equipment to this new challenge, specific solutions are...
LIGHTSpEED by UNiTYSC: The new high-end surface inspection solution for in-line monitoring and process qualification of opaque and transparent substrates
The LIGHTSpEED is the first unpatterned surface inspection solution that combines darkfield inspection and advanced synchronous doppler detection technology to capture nanometer scale defects on all kind of wafers. Grenoble, France – Tuesday, July 9th, 2019 – UnitySC,...