Breaking throught the Computing & Memory wall

Enabling new architectures, applications & services




High Perfermance Computing


Enabling a smart world

High End Performances are a must today to face the need of Data Center, the Cloud and the related High-Speed Network to share data and third part services.To assure the need, Heterogeneous Integration based on 2.5D and/or 3D stacking and vertical electrical interconnections with Through Silicon Vias (TSV) or hybrid bonding was adopted by semiconductor industry and moved in few years from proof of concept to full production in high volume.

With the mission of supporting our customers, at Unitysc we work to anticipate the process control need of today and tomorrow.

High Bandwith Memory


Sustaining the rise of Memory, Towards Ultra HBM

With High-Bandwidth Memory (HBM), an additional opportunity on hardware side for performance benefits is given. Next-generation of supercomputers, graphics systems, and artificial intelligence (AI) systems will require a large amount of available bandwidth compared to regular DRAM allowing the execution of high numbers of threads in parallel masking penalties of concurrent memory accesses.

Discover how Unitysc can help Semiconductors’ R&D department to design new architectures and sustain the HBM wave.




Automation, Electrification, Digital connectivity and advanced security ! All these trends have one common enabler, advances in semiconductor components. Discover how Unitysc can help Semiconductor vendors to reach the ultimate level 5 of the automotive industry.


Internet Of Thing

IoT technology in its ultimate form will consist of an ecosystem of securely hyperconnected devices driving the word of tommorow. Discover how Unitysc  helps Semiconductor vendors accelerate the next IoT generation

AI & Extended Reality

Augmented reality and artificial intelligence are distinct technologies, but together they create unique digital experiences. Discover how Unitysc  help Semiconductor industry moving the boundaries of the digital world.


What’s new

Press releases


LETI Innovation Days

LETI Innovation Days  DEEP TECH FOR EDGE ARTIFICIAL INTELLIGENCE Explore the power of distributed artificial intelligence, also called "Edge AI" during the Leti innovation Days on June 24-28, 2019 in Grenoble. Join to trigger the creative part of your brain and create...