Driven by automotive market growing, power devices are now requested to fulfill the Zero-Defect policy edicted by Power Device Manufacturers leading the market.
Much more than adapting old technologies and equipment to this new challenge, specific solutions are mandatory for this new challenge for 3 reasons
• Enhance the defect capture on known issues
• Catch new defects which can induce latent failures.
• Manage the new substrates introduced by the latest technologies, such as GaN, SiC, very thin wafers, high warpage …
Starting more than 10 years ago, Unity has been a pioneer proposing solutions adapted to this market, by developing his product-line in partnership with tier one players, reaching today the most suitable toolset for this market.
The LIGHTsEE series was specifically designed to match the power market. It handles thin wafers, both with and without taiko rings to thicknesses of a few dozens of microns. Thanks to unique stress-free designs, using advanced Bernoulli and gravity technology, the wafers can be fully scanned without being applied any mechanical constraint and offers an all surface inspection : frontside, backside and Edge five zones.
In terms of defectivity, our systems were developed to catch defects that are unique to power device manufacturing. This covers both topographic defects including slip lines, comets or grinding marks related to thinning process and in-plane defects like crystal defects, cracks, nanometer scale contamination or surface roughness.
The LIGHTSpEED is an advanced Surface Scanning Inspection System addressing specifically the power market. It provides down to 45nm sensitivity with throughputs higher than 100WpH and is compatible with the latest substrate technologies. It demonstrated the highest data quality on both opaque substrates, including GaN, GaAs and epi products and transparent substrates like SiC, Glass stacks and sapphire. Thanks to its patented Synchronous Doppler Detection technology (SDD™) and its unique features including a wafer to wafer autofocus, it is as well suited to replace standard darkfield inspection system than introducing new capabilities on exotic products.
From the metrology aspect, the ATHOS series, which is a combination of technologies embedded into same optical path, was adopted by Power market in order to qualify new substrates such as GaN or SiC. Besides, some other challenges were encountered as trench metrology control for depth and width process validation.
With LightSEE HR and LightSpeed II, and recently released Athos equipment, a new generation is now available for highest performances and enhanced capabilities, offering leading edge equipment tackling power new challenges.
COME TO MEET US AND DISCOVER OUR TECHNOLOGY DURING SEMICON TAIWAN ON OUR BOOTH J2750, 1ST FLOOR, SILICON EUROPE AREA, THE 18TH, 19TH AND 20TH SEPTEMBER 2019.