Accelerating the Next Generation Internet of Things
From connected divices to Human value.
Enabling a smart world
Designing chips for Edge is far different than for the IoT. Driven by the explosion of information, the volume of data generated, transferred and stored is rising day by day,
Each Edge device need to be customized and require fast processing using low power, accuratly enought and reliable overtime. More over, inteligency is brought back at the device level / data source (Smart homes,cities,factories, vehicules etc … )
Discover how Unitysc can help Semiconductors’ R&D department to design Edge computing and devices to sustain the fifth wave of computing.
A Digital transformation
A new wave of hyperconnectivity is fueled thanks to the incoming 5G technology. With major drivers form factor, performances and integration, advanced packaging, and more specifically Fan-Out Wafer Level Packaging (FOWLP) is the way the semiconductor industry faces the challenge.
At UnitySC we developed ad hoc systems to support the R&D phase and secure the process control in HVM
Discover Unitysc solutions to maximize the yield in High Density Fan Out packaging. Our combination of multiple technologies with a patented optical head to share vision capability with measurement capability is the key to reach best in class performances on metrology characterization of MOLD Compound, passivation TMV.
Cloud computing expansion
Cloud computing gives users access to computing, storage, and networking resources on demand. Machine Learning, Artificial Intelligency, Authentification, Data Analytics and services require specific chips design. A transformation in the compute/hyperscale value chain is starting with new players entering the chip market.
Discover how Unitysc can help Semiconductors vendor sustaining R&D department to design their specific chip.
Automation, Electrification, Digital connectivity and advanced security ! All these trends have one common enabler, advances in semiconductor components. Discover how Unitysc can help Semiconductor vendors to reach the ultimate level 5 of the automotive industry.
Memory : High Perf. Computing (HPC) & High Band. Memory (HBM)
AI-driven data analytics is based on real-time data processing on a large scale. Discover how Unitysc help Semiconductor industry in optimizing computing and memory architecture so that large data sets and time-critical data can be more efficiently and securely handled.
Augmented reality and artificial intelligence are distinct technologies, but together they create unique digital experiences. Discover how Unitysc help Semiconductor industry moving the boundaries of the digital world.
UnitySC, the leading provider of metrology and inspection equipment for the semiconductor industry, today announces a successful EUR 48 million funding round led by Jolt Capital, the French State through French Tech Souveraineté (a program operated by Bpifrance) and...
UnitySC, le leader des équipements de métrologie et d’inspection pour l’industrie des semi-conducteurs, annonce une levée de 48M€ auprès de Jolt Capital, de l’Etat français au travers du fonds French Tech Souveraineté (programme géré par Bpifrance) et de Supernova...
Mr Sungtae Kim, our Korean Key Account Director, and his team will be ready to meet you at SEMICON Korea, the key meeting on semiconductor market. Then event will be held from the 5th to the 7th of February 2020, at the Korea World Trade Tower, #4205, 511,...
UnitySC was represented during two important events this week : Our Key Account Managers Mr Yves Budillon, and Mr Gilles Vera have hold a booth during the SEMICON Europa in Munich from the 12th to the 15th of November. They have been joined by our Product Line Manager...
We are pleased to announce that UnitySC has expanded to open a new office in South Korea ! UnitySC has officially opened a new office in Yongin-si, South Korea, the 28th of October 2019. As part of the strategy and worldwide growth, UnitySC is expanding locally its...
Mr Mathieu NOEL, Product Line Manager for Metrology solutions at UnitySC, will present a paper during the MEMS World Summit, the 11th and 12th November 2019 at the Hilton Munich Park Hotel. The paper subject will be "Technologies development driven by MEMS...