Accelerating the Next Generation Internet of Things
From connected divices to Human value.
Enabling a smart world
Designing chips for Edge is far different than for the IoT. Driven by the explosion of information, the volume of data generated, transferred and stored is rising day by day,
Each Edge device need to be customized and require fast processing using low power, accuratly enought and reliable overtime. More over, inteligency is brought back at the device level / data source (Smart homes,cities,factories, vehicules etc … )
Discover how Unitysc can help Semiconductors’ R&D department to design Edge computing and devices to sustain the fifth wave of computing.
A Digital transformation
A new wave of hyperconnectivity is fueled thanks to the incoming 5G technology. With major drivers form factor, performances and integration, advanced packaging, and more specifically Fan-Out Wafer Level Packaging (FOWLP) is the way the semiconductor industry faces the challenge.
At UnitySC we developed ad hoc systems to support the R&D phase and secure the process control in HVM
Discover Unitysc solutions to maximize the yield in High Density Fan Out packaging. Our combination of multiple technologies with a patented optical head to share vision capability with measurement capability is the key to reach best in class performances on metrology characterization of MOLD Compound, passivation TMV.
Cloud computing expansion
Cloud computing gives users access to computing, storage, and networking resources on demand. Machine Learning, Artificial Intelligency, Authentification, Data Analytics and services require specific chips design. A transformation in the compute/hyperscale value chain is starting with new players entering the chip market.
Discover how Unitysc can help Semiconductors vendor sustaining R&D department to design their specific chip.
Automation, Electrification, Digital connectivity and advanced security ! All these trends have one common enabler, advances in semiconductor components. Discover how Unitysc can help Semiconductor vendors to reach the ultimate level 5 of the automotive industry.
Memory : High Perf. Computing (HPC) & High Band. Memory (HBM)
AI-driven data analytics is based on real-time data processing on a large scale. Discover how Unitysc help Semiconductor industry in optimizing computing and memory architecture so that large data sets and time-critical data can be more efficiently and securely handled.
Augmented reality and artificial intelligence are distinct technologies, but together they create unique digital experiences. Discover how Unitysc help Semiconductor industry moving the boundaries of the digital world.
Driven by automotive market growing, power devices are now requested to fulfill the Zero-Defect policy edicted by Power Device Manufacturers leading the market. Much more than adapting old technologies and equipment to this new challenge, specific solutions are...
LIGHTSpEED by UNiTYSC: The new high-end surface inspection solution for in-line monitoring and process qualification of opaque and transparent substrates
The LIGHTSpEED is the first unpatterned surface inspection solution that combines darkfield inspection and advanced synchronous doppler detection technology to capture nanometer scale defects on all kind of wafers. Grenoble, France – Tuesday, July 9th, 2019 – UnitySC,...
During the ASTC conference held in Marina Bay Sands Convention Centre - Singapore, the 7th and 8th of November 2019, Unity Semiconductor will present a paper entitled : Process Control solutions for Advanced Packaging You can already read below...
Mr Mathieu NOEL, Product Line Manager for Metrology solutions at UnitySC, will present a paper during the MEMS World Summit, the 11th and 12th November 2019 at the Hilton Munich Park Hotel. The paper subject will be "Technologies development driven by MEMS...
UNITY SC OPENS A NEW LOCATION IN GERMANY Montbonnot-Saint-Martin, the 12th of September 2019. Unity SC is deploying rapidly the strategic execution plan to differentiate in the market, and adapting its resources globally to address the fast growth. At the same time,...
GreenTropism and UnitySC sign MoU to collaborate tackling Molecular contamination identification on Advance Packaging issues using advanced sensing and artificial intelligence Taiwan, September 17, 2019 - GreenTropism a leading French startup on artificial...