Accelerating the Next Generation Internet of Things
From connected divices to Human value.
Enabling a smart world
Designing chips for Edge is far different than for the IoT. Driven by the explosion of information, the volume of data generated, transferred and stored is rising day by day,
Each Edge device need to be customized and require fast processing using low power, accuratly enought and reliable overtime. More over, inteligency is brought back at the device level / data source (Smart homes,cities,factories, vehicules etc … )
Discover how Unitysc can help Semiconductors’ R&D department to design Edge computing and devices to sustain the fifth wave of computing.
A Digital transformation
A new wave of hyperconnectivity is fueled thanks to the incoming 5G technology. With major drivers form factor, performances and integration, advanced packaging, and more specifically Fan-Out Wafer Level Packaging (FOWLP) is the way the semiconductor industry faces the challenge.
At UnitySC we developed ad hoc systems to support the R&D phase and secure the process control in HVM
Discover Unitysc solutions to maximize the yield in High Density Fan Out packaging. Our combination of multiple technologies with a patented optical head to share vision capability with measurement capability is the key to reach best in class performances on metrology characterization of MOLD Compound, passivation TMV.
Cloud computing expansion
Cloud computing gives users access to computing, storage, and networking resources on demand. Machine Learning, Artificial Intelligency, Authentification, Data Analytics and services require specific chips design. A transformation in the compute/hyperscale value chain is starting with new players entering the chip market.
Discover how Unitysc can help Semiconductors vendor sustaining R&D department to design their specific chip.
Automation, Electrification, Digital connectivity and advanced security ! All these trends have one common enabler, advances in semiconductor components. Discover how Unitysc can help Semiconductor vendors to reach the ultimate level 5 of the automotive industry.
Memory : High Perf. Computing (HPC) & High Band. Memory (HBM)
AI-driven data analytics is based on real-time data processing on a large scale. Discover how Unitysc help Semiconductor industry in optimizing computing and memory architecture so that large data sets and time-critical data can be more efficiently and securely handled.
Augmented reality and artificial intelligence are distinct technologies, but together they create unique digital experiences. Discover how Unitysc help Semiconductor industry moving the boundaries of the digital world.
Unity-SC Demonstrates Its Unique Capability to Detect Non-scattering Potential Killer Defects on GaAs Substrates with Major VCSEL Manufacturer
Together with a key player in the VCSEL market, Unity-SC was able to improve their yield by sorting out wafers that presented defects only visible using the LIGHTsEE PSD™. If not detected, these defects can lead to failure later in the process or after system...
CEA-Leti and UnitySC Announce Further Development To Fuel Industry 4.0 with Smarter Tools SAN FRANCISCO – July 10, 2019 – Leti, a research institute of CEA Tech, and UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology...
LETI Innovation Days DEEP TECH FOR EDGE ARTIFICIAL INTELLIGENCE Explore the power of distributed artificial intelligence, also called "Edge AI" during the Leti innovation Days on June 24-28, 2019 in Grenoble. Join to trigger the creative part of your brain and create...
The 13th International Conference on Nitride Semiconductors 2019 will present high-impact scientific and technological advances in materials and devices based on group-III nitride semiconductors, and will feature plenary sessions, parallel topical sessions, poster...
Driven by automotive market growing, power devices are now requested to fulfill the Zero-Defect policy edicted by Power Device Manufacturers leading the market. Much more than adapting old technologies and equipment to this new challenge, specific solutions are...
LIGHTSpEED by UNiTYSC: The new high-end surface inspection solution for in-line monitoring and process qualification of opaque and transparent substrates
The LIGHTSpEED is the first unpatterned surface inspection solution that combines darkfield inspection and advanced synchronous doppler detection technology to capture nanometer scale defects on all kind of wafers. Grenoble, France – Tuesday, July 9th, 2019 – UnitySC,...