METROLOGY SOLUTIONS
TMAP-AP
The TMAP-AP is the complete metrology solution for 3D IC/TSV process control with the best balance between performance, throughput and cost of ownership (CoO).
The TMAP-AP measure multiple layer stacks and differentiate them in the order they are placed. Even under highly warped conditions, the TMAP Series’ state of the art design provides dependable measurement where and when you need it.
Main Applications
Advanced Packaging |
MEMS |
FOWLP |
2.5D & 3D IC TSV |
HBM |
TMAP-NST
The TMAP NST is a non contact full field metrology solution based on optical microscopy enabling surface topography measurements at the nano scale.
The TMAP NST is pushing the boundaries of conventional microscopy with performances that stretch beyond contact profilometry and into the AFM space.
Main Applications
Cu CMP |
Hybrid Bonding : Pre/Post Bonding |
Front End CMP |
Front End Etch |
On/Out of plane Overlay |
INSPECTION SOLUTIONS
LightSPEED
The LIGHTSpEED is the first unpatterned surface inspection solution that combines darkfield inspection and advanced Synchronous Doppler Detection Technology to capture nanometer scale defects on all kind of wafers.
As a part of the modular LIGHTsEE series from UnitySC the LIGHTSpEED can be used as a stand-alone tool or as part of a cluster in combination with other UnitySC technologies such as Phase Shift Deflectometry or brightfield confocal chromatic 2D inspection.
Main Applications
IQC |
Process Monitoring |
Specialty Substrate |
Advanced Packaging |
Power |
MEMS |
LightSEE
The LIGHTsEE, Combo PSD/iEDGE is the leading solution for Power applications to reveal latent defects. It allows to detect sliplines, cristalographic defects as well as particles and contamination.
It also integrates a highly sensitive edge inspection can inspect standard, thin and Taiko wafers. This Combo is a unique solution for Slip lines and nanometer scale defect detection without contact, allowing simultaneous double side inspection.
Main Applications
Epi Inspection |
Advanced Packaging |
Wafer Thinning |
Wafer Maker |
Power / IGBT |
ODIN
ODIN is a fully automated high-resolution AOI tool for the optical inspection of patterned and non-patterned wafers, their edges and back sides. All these features are seamlessly integrated in one single platform. Advanced 2D- and 3D metrology options for CD, OVL, VIA and film thickness and additional modules for super-fast macro scans (WOTAN) and edge inspection (THOR) enable true all-side wafer inspection and characterization.
Another key feature of this platform is the combined high throughput and high sensitivity, which is unique for automated macro inspection systems on the marketAny defect found can be captured in parallel and in the same run with the help of a built-in high-end microscope with Optics by Carl Zeiss.
Main Applications
True Color Imaging Technology |
3D CCS Bump Measurement |
Advanced Automasking |
Integrated High resolution review µscopy |
Probe Mark Inspection |
Integrated Metrology for CD/OVL |
WOTAN
WOTAN is a fully automated, recipe-free, high-speed AOI tool for simultaneous front and back side inspection. It automatically detects macroscopic defects based on a wafer-to-wafer comparison. Key application is high throughput process monitoring and tool control . Easy-to-read instant result display options allow short correction cycles.
WOTAN is available stand-alone and in combination with edge inspection modules (THOR).
Main Applications
BS Roughness Monitoring |
Wafer Signature Detection |
Litho Defocus & Tilt Detection |
Color Variation Detection |
Automated Scribe Line Masking |
THOR
THOR is a fully automated, high-speed, high sensitivity AOI tool for edge inspection in all five zones. The built-in edge bead removal (EBR) metrology option allows for precise process monitoring and tool control.
THOR can be incorporated as a module into ODIN and WOTAN platforms to enable true all-side wafer inspection and characterization.
Main Applications
EBR/WEE |
Overprinted Edge Inspection |
Advanced Defect Binning (ADB) |
Wafer Maker |
Bonding 3D Packaging |
All Edge Zones |
AXIOSPECT
Axiospect is a versatile tool family for automatic and manual optical inspection, review and metrology. It’s flexibility comprises vacuum and edge grip wafer handling, optional macro and edge inspection modules as well as metrology options for CD, OVL and film thickness.
Axiospect is the optimal complement to any optical defect inspection system for its automatic defect review ability based on KLARF. The wide range of available optical imaging techniques make it a universal tool for in-line defect engineering. It seamlessly integrates into wafer fab automation and comprises Optics by Carl Zeiss.
Main Applications
Macro Defect Documentation (DEDO) |
360° Tilt & Wobble Macro |
CD/OVL |
FS/BS µScopy |
Film Thickness |
Internet Of Thing
IoT technology in its ultimate form will consist of an ecosystem of securely hyperconnected devices driving the word of tommorow. Discover how Unitysc helps semiconductor vendors accelerating the next IoT generation.
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High Perf. Computing (HPC) & High Band. Memory (HBM)
AI-driven data analytics is based on real-time data processing on a large scale. Discover how Unitysc helps Semiconductor industry in optimizing computing and memory architecture so that large data sets and time-critical data can be more efficiently and securely handled.
Automotive
Automation, Electrification, Digital connectivity and advanced security ! All these trends have one common enabler, advances in semiconductor components. Discover how Unitysc can help Semiconductor vendors to reach the ultimate level 5 of the automotive industry.
AI & Extended Reality
Augmented reality and artificial intelligence are distinct technologies, but together they create unique digital experiences. Discover how Unitysc helps the Semiconductor industry move the boundaries of the digital world.
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What’s new
Press releases
Léa ALZINGRE, CFO of Soitec, joins UnitySC board of directors
UnitySC is delighted to announce the appointment of Léa ALZINGRE, CFO of Soitec, as an independent member of its board of directors and chairwoman of the audit committee. Her history Léa ALZINGRE has been CFO of Soitec since July 2020. Soitec (Euronext Paris) is a...
Paul Boudre appointed chairman of UnitySC
UnitySC, a leading provider of metrology and inspection equipment for the semiconductor industry, is delighted to announce the appointment of Paul Boudre, former CEO of Soitec, as chairman of its board of directors. Paul Boudre was the CEO of Soitec [EPA:SOI], a world...
Events
Join the UNITY-SC team at SEMICON EUROPA from November 15-18, 2022 in Munich, a key meeting for the semiconductor market.
UnitySC European team will be pleased to welcome you at booth 160, hall C1, in Messe München, Munich, Germany. Visit us to discover our range of inspection and metrology tools combining advanced technologies used for Unpatterned & Patterned Defect inspection...
Meet UnitySC during SEMICON Korea
Mr Sungtae Kim, our Korean Key Account Director, and his team will be ready to meet you at SEMICON Korea, the key meeting on semiconductor market. Then event will be held from the 5th to the 7th of February 2020, at the Korea World Trade Tower, #4205, 511,...
News
UnitySC Opens a New Office in South Korea
We are pleased to announce that UnitySC has expanded to open a new office in South Korea ! UnitySC has officially opened a new office in Yongin-si, South Korea, the 28th of October 2019. As part of the strategy and worldwide growth, UnitySC is expanding locally its...
“Technologies development driven by MEMS challenges” at MEMS World Summit 2019
Mr Mathieu NOEL, Product Line Manager for Metrology solutions at UnitySC, will present a paper during the MEMS World Summit, the 11th and 12th November 2019 at the Hilton Munich Park Hotel. The paper subject will be "Technologies development driven by MEMS...