The TMAP-AP is the complete metrology solution for 3D IC/TSV process control with the best balance between performance, throughput and cost of ownership (CoO).
The TMAP-AP measure multiple layer stacks and differentiate them in the order they are placed. Even under highly warped conditions, the TMAP Series’ state of the art design provides dependable measurement where and when you need it.
2.5D & 3D IC TSV
The TMAP NST is a non contact full field metrology solution based on optical microscopy enabling surface topography measurements at the nano scale.
The TMAP NST is pushing the boundaries of conventional microscopy with performances that stretch beyond contact profilometry and into the AFM space.
Hybrid Bonding : Pre/Post Bonding
Front End CMP
Front End Etch
On/Out of plane Overlay
The LIGHTSpEED is the first unpatterned surface inspection solution that combines darkfield inspection and advanced Synchronous Doppler Detection Technology to capture nanometer scale defects on all kind of wafers.
As a part of the modular LIGHTsEE series from UnitySC the LIGHTSpEED can be used as a stand-alone tool or as part of a cluster in combination with other UnitySC technologies such as Phase Shift Deflectometry or brightfield confocal chromatic 2D inspection.
The LIGHTsEE, Combo PSD/iEDGE is the leading solution for Power applications to reveal latent defects. It allows to detect sliplines, cristalographic defects as well as particles and contamination.
It also integrates a highly sensitive edge inspection can inspect standard, thin and Taiko wafers. This Combo is a unique solution for Slip lines and nanometer scale defect detection without contact, allowing simultaneous double side inspection.
Power / IGBT
ODIN is a fully automated high-resolution AOI tool for the optical inspection of patterned and non-patterned wafers, their edges and back sides. All these features are seamlessly integrated in one single platform. Advanced 2D- and 3D metrology options for CD, OVL, VIA and film thickness and additional modules for super-fast macro scans (WOTAN) and edge inspection (THOR) enable true all-side wafer inspection and characterization.
Another key feature of this platform is the combined high throughput and high sensitivity, which is unique for automated macro inspection systems on the marketAny defect found can be captured in parallel and in the same run with the help of a built-in high-end microscope with Optics by Carl Zeiss.
True Color Imaging Technology
3D CCS Bump Measurement
Integrated High resolution review µscopy
Probe Mark Inspection
Integrated Metrology for CD/OVL
WOTAN is a fully automated, recipe-free, high-speed AOI tool for simultaneous front and back side inspection. It automatically detects macroscopic defects based on a wafer-to-wafer comparison. Key application is high throughput process monitoring and tool control . Easy-to-read instant result display options allow short correction cycles.
WOTAN is available stand-alone and in combination with edge inspection modules (THOR).
BS Roughness Monitoring
Wafer Signature Detection
Litho Defocus & Tilt Detection
Color Variation Detection
Automated Scribe Line Masking
THOR is a fully automated, high-speed, high sensitivity AOI tool for edge inspection in all five zones. The built-in edge bead removal (EBR) metrology option allows for precise process monitoring and tool control.
THOR can be incorporated as a module into ODIN and WOTAN platforms to enable true all-side wafer inspection and characterization.
Overprinted Edge Inspection
Advanced Defect Binning (ADB)
Bonding 3D Packaging
All Edge Zones
Axiospect is a versatile tool family for automatic and manual optical inspection, review and metrology. It’s flexibility comprises vacuum and edge grip wafer handling, optional macro and edge inspection modules as well as metrology options for CD, OVL and film thickness.
Axiospect is the optimal complement to any optical defect inspection system for its automatic defect review ability based on KLARF. The wide range of available optical imaging techniques make it a universal tool for in-line defect engineering. It seamlessly integrates into wafer fab automation and comprises Optics by Carl Zeiss.
Macro Defect Documentation (DEDO)
360° Tilt & Wobble Macro
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UnitySC is delighted to announce the appointment of Léa ALZINGRE, CFO of Soitec, as an independent member of its board of directors and chairwoman of the audit committee. Her history Léa ALZINGRE has been CFO of Soitec since July 2020. Soitec (Euronext Paris)...
UnitySC, a leading provider of metrology and inspection equipment for the semiconductor industry, is delighted to announce the appointment of Paul Boudre, former CEO of Soitec, as chairman of its board of directors. Paul Boudre was the CEO of Soitec [EPA:SOI], a world...
Mark your calendars for November 14-17, 2023, as Munich gears up to host SEMICON EUROPA, a pivotal event in the world of semiconductors. If you're in the industry, this is an opportunity you simply can't afford to miss. The UnitySC European team is thrilled to...
Join the UNITY-SC team at SEMICON EUROPA from November 15-18, 2022 in Munich, a key meeting for the semiconductor market.
UnitySC European team will be pleased to welcome you at booth 160, hall C1, in Messe München, Munich, Germany. Visit us to discover our range of inspection and metrology tools combining advanced technologies used for Unpatterned & Patterned Defect...
UnitySC rejoint France Deeptech en novembre 2023, la communauté qui rassemble les acteurs de la deeptech pour une réponse entrepreneuriale, collective et scientifique à nos défis contemporains
UnitySC est désormais membre officiel de France Deeptech, une association révolutionnaire lancée officiellement le 29 novembre à la BnF Richelieu, sous le patronage distingué de trois ministres éminents – Sylvie Retailleau, Roland Lescure et Jean-Noël Barrot. Ce...
Mohamad’s Journey: From the Application Development field to a Leader & Product Gatekeeper at UnitySC
Mohamad, a former research engineer at CEA Grenoble, discovered UnitySC in 2018 through a collaborative project, capturing his heart and leading him to join as a Junior Application Engineer. Pioneering Role in Metrology Assigned to showcase Metrology tools at...