“ Our mission is to Enable our Customers to Yield Higher and Faster; by Providing Differentiated Process Control Solutions.”

Management Team

Dan Lee - CEO
  • 30+years in Semiconductor Industry
  • President of KLA-Tencor S’pore (2006 – 2015)
  • Head of Customer Group, Advanced Packaging, Applied Materials (2016 – 2019)
  • Senior leadership roles in Cadence, Hewlett-Packard
  • Experienced in Packaging Technology, Front End Wafer Fabrication Process, Metrology and Inspection, IC-Design, Test & Measurement Solutions
  • Business Skills include Business Transformation, sales, marketing, product management, mfgg, field support, P/L
  • Msc. In Electrical Engg, UMIST
Dr Isaac Ow - SVP BU
  • General Manger, Key Product Unit Head, Applied Materials
  • Packaging Technologies & wafer mfg process
  • Management of Product Development, Global Product Management & Global Engineering Teams
  • Executive management approval committee member for Product Life Cycle (PLC) processes & product releases
  • Executive management approval committee member for Patent filings
  • Experienced in M&A for IP acquisition
  • Target market segment and applications
  • P/L
Eloi Delorme - CFO
  • 25 years in Finance and management level
  • Worked at RECIF as CFO and CEO
  • Specialized in fund raising and Operations management
Denis Le Bellego - VP Head of Services
  • 23 years experience of Semiconductor industry with Philips Semiconductor and then KLA-Tencor amongst others
  • Founded the Advanced Metrology program inside FOGALE Nanotech
  • Successfully developed the WW Support Organization
Graham Lynch - Industry Advisor
  • 23 years in Semicon
  • Worked at Chartered (GloFo), KLA-Tencor & Nanometrics
  • Front End Wafer Fab Defect/Yield, M&I Equipment, Strategic Marketing/M&A
Gilles Fresquet - Advisor
  • 35 years of semiconductor experiences
  • Worked at Thomson, Motorola and RECIF at management level
  • Successfully developed the semiconductor activities in Fogale Nanotech since 2008
  • He hold a MSc. In Physics and in semiconductor materials.

Board Management Team

Patrick Leteurtre - President of Fogale Nanotech
  • Since 1996, he is the Chairman of the board, President and CEO of Fogale Nanotech SA.
  • Created the subsidiary, Fogale biotech, Fogale sensation and Unity SC.
  • Also the chairman of Foreign Subsidiaries of the group Fogale Nanotech.
  • Held senior level management positions in the technology field since his early roles at Dassault Aviation.
  • Holds a Master’s of Science degree in mechanical engineering from the University of PARIS 10.
Pierre Garnier - Partner at JOLT CAPITAL
  • Since 2018 Pierre is Partner at Jolt-Capital driving Investments and portfolio companies within the deeptech Hardware segment.
  • He is a semiconductor veteran and was President & CEO at e2V Semiconductors that he sold to Teledyne in 2017, COO at Inside Secure (NYSE VMX), VP&GM of Texas Instruments Wireless BU, CEO of Everbee Networks, GM of Alcatel Microelectronics that he sold in 2002 to STmicroelectronics.
  • He acted for Fogale Group in 2016 to drive the acquisition and integration of Altatech to form Unity sc
  • He graduated in 1992 from Central-Supelec Paris tech and is Doctorate in Solid State Physics from University of Paris
Paul Boudre - CEO of Soitec
  • Chief executive officer and board member of Soitec, since 2015.
  • Serves on the boards of directors for FOGALE nanotech, Interel, Blackwood Seven, Softonic, and INSIDE Secure (EURONEXT:INSD).
  • Member of the European Advisory Board of SEMI, the global industry association serving the electronics manufacturing supply chain.
  • More than 30 years in the global semiconductor industry, and 10 years at KLA-Tencor.
Yves Maitre - CEO of HTC
  • Named CEO of HTC in September 2019
  • Serves as an Executive Vice President for Connected Objects and Partnerships at Orange Group.
  • Served as Senior Vice President of Mobile Multimedia and Devices and Vice President of Devices at Orange.
  • Served as President of Key MRO America, a subsidiary of Thomson United States. He served as Director of Manufacturing Supply Chain and Product Management at Thomson Asia.
  • Independent Director of Sequans Communications S.A. since June 2014 and serves as its Lead Independent Director.
  • Serves as a Board member of Orange China and several midsize / start-up companies.
Zain Saidin - Former EVP , KLA
  • 25+ years in Semiconductor Industry
  • Former Chief Engineer and Executive Vice President at KLA
  • Responsible for various multi-national design teams, and new product introduction.
  • M&A Integration
  • Company-wide Product Life Cycle policy
  • Engineering talent development
  • Numerous patents in semi inspection and metrology