Unitysc European Leader in Metrology & Inspection
Innovative Technology and Solution for Semiconductor
Let’s explore Unity SC
Our Mission is to become Worldwide leader in Process control solutions for advanced applications offering the right cost effective solution with high reliability to our customers
INSPECTIONS
Unity offers a wide product range for defect detection down to nanometer range at very high throughput. Full automatic equipment using leading edge technologies are designed to fulfill high volume manufacturing requirements.
METROLOGY
By an extensive mastering of optical technologies, Unity metrology equipment offers a unique solution for high accuracy dimentionnal metrology.
SERVICES
For each customer project, Unitysc offers a shared detailed project analysis including application, process and hardware.
Let’s discover the company solutions
High-precision offer at the cutting edge of technology, personalized support, services and flawless quality are the values that Unitysc wishes to share with you.
Let’s build together the technology of tomorrow around the world !
What’s new
Press releases
UnitySC opens new Asia entity to support advanced packaging and power device markets
Unity Semiconductor Limited Company Will Provide Application Engineering and Field Service Support to Local Customers Hsinchu, Taiwan – May 8, 2018 – UnitySC, a leader in advanced inspection and metrology solutions, today announced the opening of its Asia subsidiary,...
UnitySC names Kamel Ait-Mahiout as CEO
Ait-Mahiout Brings Strong Track Record of Growth at Amkor Europe and Significant Operational Experience Grenoble, France – April 17, 2018 – UnitySC, a leader in advanced inspection and metrology solutions for the semiconductor and related industries, today announced...
Events
IMAPS Device Packaging 2018
Fountain Hills, Arizona UnitySC will be exhibiting on booth #60. Dario Alliata, Product Manager will also deliver two talks respectively entitled Progress in Time-Domain Optical Coherence Tomography for TSV/3Di stacking Metrology and Wafer Nano Topography and Edge...
3D Architectures for Heterogeneous Integration and Packaging (3D ASIP)
San Francisco, USA Gilles Fresquet, CEO UnitySC, will deliver an invited talk entitled "TSV, FOWLP, Hybrid Bonding : Review of Metrology Challenges and Solutions to Support HVM". Check the event website for more information.
News
克服大批量薄晶圆制造中的检测挑战
有人已经考虑将暗视野检测用于检测薄晶圆缺陷。基于光学技术，暗视野是指进行较低角度反射光测量。 暗视野对于晶圆前端检测是有效的，但是由于研磨造成晶圆背面粗糙，对于背面检测它是无效的。因此，晶圆背面研磨后应避免暗视野检测。 Read...
Technical Tidbits from IWLPC and MSEC 2017
Francoise von Trapp (3D Incites) refers to UnitySC's latest announcement in her coverage of IWLPC. After reading the announcement of UnitySC’s opening of its new software development lab and customer support demo lab, I caught up with the Philippe Gastaldo, Product...