LightiX is a fully automated high-resolution AOI Tool. Modular Inspections for patterned and non-patterned wafers.
Front, Back & Edges Inspection with comprehensive 2D and 3D metrology options.
• Next generation macro inspection system (AOI).
• All-side wafer inspection: Front, back and edge inspection.
• 100% defect images without throughput impact.
• Integrated high-end microscope review.
• True Color Inspection (TCI) technology.
• Advanced CD, 2D/3D, OVL and EBR metrology.
• Automatic defect classification
• Best in class cost of ownership for high resolution AOI
• High-speed patterned wafer inspection
• High defect sensitivity
• ISO Class 1 certified
• Tool – to – tool matching
High Sensitivity Dark Field Surface Inspection can be used also for any Material composition such as opaque transparent Wafers
• High throughput
• Nanometer scale sensitivity
• Full haze characterization
• Multisize capability
• Pits / Particle distinction
• High lifetime / low CoO solid state laser
• Advanced Automatic Defect Classification
Edge and Backside Inspection with best in class COO.
Front and Back Side Topography Defect Detection at Nanometer Range combined with high depth of focus edge inspection solution.
- High throughput
- Nanometer range vertical sensitivity
- Simultaneous double side inspection
- Nanotopography and Topography measurement
- Detection of Slip lines, particles, Hairline cracks, SOI voids, Comets, EPI defects…
- Compliant with thin or thick wafers, taiko wafers, highly warped wafers
High Speed Five Zone Edge Inspection & Metrology.
• Water edge defectivity and EBR measurements
• Available at all edge zones in one scan
• Ideal companion to upgrade Wotan
• High speed
• High sensitivity
Fast Macro Inspection with best in Class COO.
- Defect scanner for wafer front and backside
- Outstanding throughput allows up to 100% wafer sampling rates
- Ideally used for OQA and excursion control