INSPECTION SOLUTIONS
High Sensitivity Dark Field Surface Inspection can be used also for any Material composition such as opaque transparent Wafers
Key Features
• High throughput
• Nanometer scale sensitivity
• Autofocus
• Full haze characterization
• Multisize capability
• Pits / Particle distinction
• High lifetime / low CoO solid state laser
• Advanced Automatic Defect Classification
Edge and Backside Inspection with best in class COO.
Key Features
• Best in class throughput
• High surface sentivity
• Full haze characterization
• High lifetime / low CoO solid state laser
• Advanced Automatic Defect Classification
Front and Back Side Topography Defect Detection at Nanometer Range combined with high depth of focus edge inspection solution.
Key Features
- High throughput
- Nanometer range vertical sensitivity
- Simultaneous double side inspection
- Nanotopography and Topography measurement
- Detection of Slip lines, particles, Hairline cracks, SOI voids, Comets, EPI defects…
- Compliant with thin or thick wafers, taiko wafers, highly warped wafers
High Speed Five Zone Edge Inspection & Metrology.
Key Features
• Water edge defectivity and EBR measurements
• Available at all edge zones in one scan
• Ideal companion to upgrade Wotan
• High speed
• High sensitivity
Fast Macro Inspection with best in Class COO.
Key Features
- Defect scanner for wafer front and backside
- Outstanding throughput allows up to 100% wafer sampling rates
- Ideally used for OQA and excursion control