METROLOGY SOLUTIONS

Fast and high throughput in-line metrology solution

Key Features

  • Area scan with vertical resolution down to 0.1nm in a single measurement
  • Material segmentation on transparent layers -Patented
  • Unique capabilities for Cu to Cu hybrid bonding
  • Thickness measurement range from nanometers to millimeters of stacks transparent to VIS/NIR
  • Dual-distance mode to measure opaque layers and/or mix of transparent/opaque stacks
  • Bow, Warp, TTV
  • VIA depth & top/bottom CD
  • Trench depth / Height CD / side slope of steps & RDL
  • Coplanarity & CD for nails/bump, RDL, UBM height
  • Edge trim metrology
  • Nano-Scale Topography (roughness) & surface profiling
  • Overlay and lateral critical dimensions
  • Defect Inspection at surface & at bonding interface by NIR Microscopy with Reflection/Transmission

For advanced packaging and MEMS

Key Features

Measurement capabilities:
• Thickness measurement range from nanometers to millimeters of stacks transparent to VIS/NIR
• Dual-distance mode to measure opaque layers and/or mix of transparent/opaque stacks
• Wafer bow. warp. TTV
• VIA depth & top/bottom CD
• Trench depth / Height. CD. side slope of STEPs & RDL
• Nails/bump. RDL. UBM height/coplanarity & CD
• Edge trim metrology
• Nano-Scale Topography (roughness) & surface profiling
• Stress. Air gap measurement. RST for Nail reveal
• Overlay and lateral critical dimensions
• Defect Inspection at surface & at bonding interface by NIR Microscopy with Reflection/Transmission

For hybrid bonding

Key Features

• Fast and high throughput in-line metrology solution
• Area scan with vertical resolution down to 0.1nm in a single measurement
• Material segmentation on transparent layers – Patented
• Unique capabilities for Cu to Cu hybrid bonding